Comprehensive review and future prospects on chip-scale thermal management: Core of data center's thermal management
Ziyong Li,Hailiang Luo,Yuguang Jiang,Haichao Liu,Lian Xu,Kunyuan Cao,Hongjie Wu,Peng Gao,Hong Liu
DOI: https://doi.org/10.1016/j.applthermaleng.2024.123612
IF: 6.4
2024-06-10
Applied Thermal Engineering
Abstract:Data centers are increasingly important for global societal and economic advancement. The reliable operation of data centers depends on robust thermal management systems for information and communication technology (ICT-TM), which cover individual chips, servers, and overall infrastructures. Effective thermal management at the chip scale is crucial due to the rising integration and power density of chips driven by semiconductor technology advancements. This study summarizes recent progress in chip-scale thermal management, identifies challenges, and proposes solutions. Through a comprehensive review of approximately 400 studies, this article briefly compiles the latest research findings across three main areas: chip cooling mechanisms, developments in cooling technologies, and focal points for further research. The latest research outcomes concerning heat dissipation principles, influencing factors, and improvement methods have been summarized for nine key technologies: air cooling, microchannel cooling, embedded cooling, immersion cooling, spray cooling, jet cooling, heat pipe, thermoelectric cooling, and electrocaloric cooling. This study outlines six research priorities: reducing contact thermal resistance, developing novel materials, addressing hotspot thermal issues, chip temperature sensing, upgrading packaging processes, and implementing multi-scale collaborative thermal management. This paper informs research in chip-scale thermal management and provides valuable insights and references for researchers and engineers in related fields.
energy & fuels,engineering, mechanical,thermodynamics,mechanics