Abstract:With the growing need for higher memory bandwidth and computation density, 2.5D design, which involves integrating multiple chiplets onto an interposer, emerges as a promising solution. However, this integration introduces significant challenges due to increasing data rates and a large number of I/Os, necessitating advanced optimization of the power distribution networks (PDNs) both on-chip and on-interposer to mitigate the small signal noise and simultaneous switching noise (SSN). Traditional PDN optimization strategies in 2.5D systems primarily focus on reducing impedance by integrating decoupling capacitors (decaps) to lessen small signal noises. Unfortunately, relying solely on frequency-domain analysis has been proven inadequate for addressing coupled SSN, as indicated by our experimental results. In this work, we introduce a novel two-phase optimization flow using deep reinforcement learning to tackle both the on-chip small signal noise and SSN. Initially, we optimize the impedance in the frequency domain to maintain the small signal noise within acceptable limits while avoiding over-design. Subsequently, in the time domain, we refine the PDN to minimize the voltage violation integral (VVI), a more accurate measure of SSN severity. To the best of our knowledge, this is the first dual-domain optimization strategy that simultaneously addresses both the small signal noise and SSN propagation through strategic decap placement in on-chip and on-interposer PDNs, offering a significant step forward in the design of robust PDNs for 2.5D integrated systems.

A novel flexible on-die decoupling scheme using package interconnects

Silicon-Validated Power Delivery Modeling and Analysis on a 32-Nm DDR I/O Interface.

Revisiting EAVP for Power Delivery Decoupling Optimization

Analysis and Design of the Interposer PDN With Optimal Arrangement of Decoupling Capacitors

Electromagnetic Coupling Between Power Distribution Network and On-chip Inductors in Package

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

A novel cross-layer framework for early-stage power delivery and architecture co-exploration.

Noise-aware DVFS Transition Sequence Optimization for Battery-Powered IoT Devices.

Hierarchical Decoupling Capacitor Optimization for Power Distribution Network of 2.5D ICs with Co-Analysis of Frequency and Time Domains Based on Deep Reinforcement Learning

Multi-Objective Optimization for PSIJ Mitigation and Impedance Improvement Based On PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems

Decoupling Capacitor Allocation for Power Delivery Network Noise Reduction Based on Standard Cell Layouts

Decoupling Capacitor Optimization to Achieve Target Impedance in PCB PDN Design

Plane-Pair PEEC Modeling for Package Power Layer Nets with Inductance Extraction

Interposer design and measurement with various caparcitors for reducing total system PDN impedance

Decoupling capacitors optimization in a Power Distribution Network

Time Domain PDN Noise Modeling for High Performance System

Decoupling capacitance efficient placement for reducing transient power supply noise.

A Fast Decoupling Capacitor Budgeting Algorithm for Robust On-Chip Power Delivery.

Achieving Minimal PDN Impedance, SSN and Jitter on PCB with Embedded Capacitance Material

Analysis of A Low-Inductance Packaging Layout for Full-Sic Power Module Embedding Split Damping

A CAD approach for suppression of power supply noise and performance analysis of some multi-core processors in pre-layout stage