Abstract:To date, low-temperature curable polyimide (PI) materials are in great demand in the field of advanced packaging. However, their synthesis is still a challenge due to the distinct structural design contradiction between the low-temperature curable ability and other desired properties. In this work, we designed and synthesized two novel diamines with different side groups (phenyl and pyrimidine ring), named PhNH2 and SPMNH2, and applied them to construct high-performance PI. Inspired by our previously reported pyrimidine based diamine PMNH2 (Polymer, 2022, 261, 125418), we tried to explore the impact of nitrogen heterocycle position (in side group or main chain) on low temperature curable ability. Compared with the typically diamine complex with nitrogen heterocycle in main skeleton, the well-designed pyrimidine side group endowed the PI films with highly improved imidization degree (ID) and excellent thermal and mechanical properties at a low curable temperature (200oC). It should be noted that the configurations and the side group effects of diamine could modulate the temperature of polymerization and the structure of polymers, which further influenced the final performance of PI films. The copolyimide films based on SPMNH2 exhibited a high elongation of 103.4%, Young's modulus of 3.20 GPa, tensile strength of 147 MPa, 5wt% decomposition temperature (Td5%) of 524oC, glass transition temperature (Tg) of 359oC, which was much better than PI films copolymerization with PhNH2 or PMNH2 cured at 200oC. Experimental results and theoretical calculations showed that the introduction of pyrimidine side group allowed for the better catalytic effect in the reaction system, and stronger intermolecular force between the polymer chains. This is the first report about the side group effects on low-temperature curable PI films, which should be enlightening to the design of novel and high-performance diamines applied for advanced packaging and other fields.

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