MPCSM: Microservice Placement for Edge-Cloud Collaborative Smart Manufacturing

Yimeng Wang,Cong Zhao,Shusen Yang,Xuebin Ren,Luhui Wang,Peng Zhao,Xinyu Yang
DOI: https://doi.org/10.1109/tii.2020.3036406
IF: 12.3
2021-09-01
IEEE Transactions on Industrial Informatics
Abstract:Latency-aware service placement is promising in reducing the overall service response latency of proliferating edge-cloud collaborative smart manufacturing systems. However, intuitive latency estimators used by existing service placement approaches cannot accurately depict the nonlinear end-to-end (E2E) latency of multihop microservices with complex dependencies, which is severely hindering the effectiveness of latency-aware service placement. To address this issue, in this article, we present a microservice placement mechanism for edge-cloud collaborative smart manufacturing (MPCSM), where a microservice placement algorithm latency-aware edge-cloud collaborative placement supported by an accurate data-driven E2E latency estimation method is proposed. We build a real-world collaborative prototype, and conduct a case study on semiconductor manufacturing to elaborate the construction of our latency estimator. Results of extensive experiments demonstrate that the error of our E2E latency estimator is up to $10times$ less than that of existing ones, and the overall service latency with MPCSM is up to $10times$ less than that with existing service placement approaches.
automation & control systems,computer science, interdisciplinary applications,engineering, industrial
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