An Effective Framework for Predicting Performance of Solid-Solution Copper Alloys Using a Feature Engineering Technique in Machine Learning

Tiehan Fan,Jianxin Hou,Jian Hu
DOI: https://doi.org/10.3390/met13101641
IF: 2.695
2023-09-25
Metals
Abstract:Utilized extensively in a myriad of industries, solid-solution copper alloys are prized for their superior electrical conductivity and mechanical properties. However, optimizing these often mutually exclusive properties poses a challenge, especially considering the complex interplay of alloy composition and processing techniques. To address this, we introduce a novel computational framework that employs advanced feature engineering within machine learning algorithms to accurately predict the alloy's microhardness and electrical conductivity. Our methodology demonstrates a substantial enhancement over traditional data-driven models, achieving remarkable increases in R2 scores—from 0.939 to 0.971 for microhardness predictions and from −1.05 to 0.934 for electrical conductivity. Through machine learning, we also spotlight key determinants that significantly influence overall performance of solid-solution copper alloys, providing actionable insights for future alloy design and material optimization.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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