Design and Simulation of a System-in-Package Chip for Combined Navigation

Yang Yang,Guangyi Shi,Yufeng Jin
DOI: https://doi.org/10.3390/mi15020167
IF: 3.4
2024-01-23
Micromachines
Abstract:This paper proposes a system-in-package combination navigation chip. We used wire bonding, chip stacking, surface mount, and other processes to integrate satellite navigation chips, inertial navigation chips, microprocessor chips, and separation devices. Finally, we realized the hardware requirements for combined navigation in a 20 mm × 20 mm chip. Further, we performed a multi-physics simulation analysis of the package design. For antenna signals, the insertion loss was greater than −1 dB@1 GHz and the return loss was less than −10 dB@1 GHz. The amplitude of these noises of the signal between the MCU and the IMU was approximately 20%, and the maximum value of the coupling coefficient between signal lines on the top surface was 13.4174%. The ninth mode of the power plane yielded a maximum voltage of 55 mV, and all power delivery networks had a DC voltage drop of less than 2%. The highest temperature in the microsystem was approximately 42 °C. These results show that our design performed well in terms of signal, power, and thermal performance.
chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
What problem does this paper attempt to address?
The problem that this paper attempts to solve is to design and simulate a system - in - package (SiP) chip for integrated navigation. Specifically, the research aims to meet the hardware requirements of the integrated navigation system by integrating satellite navigation chips, inertial navigation chips, microprocessor chips and discrete components into a single package of 20 mm × 20 mm. In addition, multi - physical - field simulation analysis has been carried out to ensure good performance of the design in terms of signal integrity, power integrity and thermal performance. ### Main problems include: 1. **Hardware Integration**: - How to integrate multiple functional chips into a miniaturized package through wire bonding, chip stacking, surface - mount technology and other processes. - Ensure the synchronization between different chips and the design of data transmission paths. For example, satellite navigation chips need to share crystal oscillators to ensure clock synchronization. 2. **Signal Integrity**: - Analyze and optimize the insertion loss and return loss of signal paths to ensure signal quality. - Deal with interference problems in RF signal paths, such as adding ground - via rings to provide a tight return path and minimizing the length of RF signal lines as much as possible. 3. **Power Integrity**: - Analyze the resonant characteristics of the power plane to ensure that the voltage drop and impedance characteristics of the power network meet the design requirements. - Optimize the resonant noise at high frequencies by using decoupling capacitors and other methods. 4. **Thermal Performance**: - Simulate the temperature distribution of the microsystem to ensure that the maximum temperature does not exceed 42 °C and avoid performance degradation and failures caused by high temperatures. 5. **Multi - physical - field Coupling Analysis**: - Comprehensively consider electrical, thermal and mechanical characteristics and their interactions to ensure the reliability and high performance of the system in the actual working environment. Through these efforts, the research finally achieved the goal of integrating the integrated navigation system on a single chip, thereby reducing the size of the system, reducing power consumption and improving the convenience of application.