Abstract:With the increasing miniaturization of electronic devices and systems, the pitch size and dimension of solder interconnects become smaller, accordingly the current density in solder interconnects gets higher and this results in severe electromigration (EM) effect that may deteriorate the performance of solder interconnects. The studies on flip chip interconnects have shown that the configurable change of solder joints can significantly affect the electromigration behavior. In this study, the microscale Cu/Sn-58Bi/Cu joints with different geometrical configurations, i.e., right angle-type and line-type solder joints, were designed and the electromigration behavior of joints under a direct current of a density 1.5 x 10(4) A/cm(2) were investigated by SEM observation, microanalysis based on focused ion beam (FIB) and finite element simulation. The focus was placed on clarifying the influence of the solder joint configuration on the electromigration mechanism of the joint in terms of atomic diffusion distance, microregional resistance change and the change of phases in anode and cathode. Results showed that for both types of solder joints after current stressing for 112 and 224 h, Bi migrated to the anode side and congregated there, while Sn tended to enrich near the cathode side; in particular for the right angle-type solder joint the microscale hillocks and rnicrocracks occurred at the anode side caused by the compressive stress which was attributed to Bi congregation and the consequent volume expansion of the phase, while the microscale concave valleys and microcracks appeared at the cathode side caused by the tensile stress, and it was worth noticing that the phenomenon above happened non-uniformly along the interface in right angle-type joint. The microanalysis results revealed that the diffusion velocity of Bi atoms was faster than that of Sn under current stressing in the solder joint. Furthermore, observations and finite element simulation results showed that for the solder joint with an asymmetrical configuration like the right angle-type solder joint the electrons flowed toward the bottom corner of the joint where the resistance was smaller and thus the current crowding effect occurred, and this was the primary factor for causing the severe electromigration.

Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints

Effect of Grain Orientation on Electromigration Degradation in Lead-Free Solder Joints

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

Crystalline Orientation Effect of Single-Grain Sn-Rich Cu Pillar Bumps on Electromigration Lifetime

The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

Size And Geometry Effects On The Electromigration Behaviour Of Flip-Chip Sn3.5ag Solder Joints

Effect of Current Crowding on Whisker Growth at the Anode in Flip Chip Solder Joints

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Interaction Effect Between Electromigration and Microstructure Evolution in BGA Structure Cu/Sn-58Bi/Cu Solder Interconnects

Study of Electromigration-Induced Formation of Discrete Voids in Flip-Chip Solder Joints by In-Situ 3D Laminography Observation and Finite-Element Modeling

Influence Of Solder Joint Configuration On Electromigration Behavior And Microstructural Evolution Of Cu/Sn-58bi/Cu Microscale Joints

An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints

Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn–3.0Ag–0.5Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging

Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Interaction Effect between Electromigration and Microstructure Evolution

Electromigration Failure Of Snagcu Lead-Free Bga Package Assembled With Snpb Solder Paste

Study of discrete voids formation in flip-chip solder joints due to electromigration using in-situ 3 D laminography and

Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect