A Novel Simulation Method for 3D Digital-Image Correlation: Combining Virtual Stereo Vision and Image Super-Resolution Reconstruction

Hao Chen,Hao Li,Guohua Liu,Zhenyu Wang
DOI: https://doi.org/10.3390/s24134031
IF: 3.9
2024-06-21
Sensors
Abstract:3D digital-image correlation (3D-DIC) is a non-contact optical technique for full-field shape, displacement, and deformation measurement. Given the high experimental hardware costs associated with 3D-DIC, the development of high-fidelity 3D-DIC simulations holds significant value. However, existing research on 3D-DIC simulation was mainly carried out through the generation of random speckle images. This study innovatively proposes a complete 3D-DIC simulation method involving optical simulation and mechanical simulation and integrating 3D-DIC, virtual stereo vision, and image super-resolution reconstruction technology. Virtual stereo vision can reduce hardware costs and eliminate camera-synchronization errors. Image super-resolution reconstruction can compensate for the decrease in precision caused by image-resolution loss. An array of software tools such as ANSYS SPEOS 2024R1, ZEMAX 2024R1, MECHANICAL 2024R1, and MULTIDIC v1.1.0 are used to implement this simulation. Measurement systems based on stereo vision and virtual stereo vision were built and tested for use in 3D-DIC. The results of the simulation experiment show that when the synchronization error of the basic stereo-vision system (BSS) is within 10−3 time steps, the reconstruction error is within 0.005 mm and the accuracy of the virtual stereo-vision system is between the BSS's synchronization error of 10−7 and 10−6 time steps. In addition, after image super-resolution reconstruction technology is applied, the reconstruction error will be reduced to within 0.002 mm. The simulation method proposed in this study can provide a novel research path for existing researchers in the field while also offering the opportunity for researchers without access to costly hardware to participate in related research.
engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
What problem does this paper attempt to address?
The problems that this paper attempts to solve mainly focus on the high cost and precision issues related to 3D digital image correlation technology (3D - DIC). Specifically: 1. **High hardware cost**: Traditional 3D - DIC technology requires at least two synchronously - triggered cameras for measurement, which greatly increases the hardware cost. 2. **Camera synchronization error**: In scenarios requiring high - speed or high - precision measurement, precisely synchronizing cameras is often very complicated and difficult. 3. **Loss of image resolution**: Due to inevitable intensity changes and nonlinear geometric distortion, traditional 3D - DIC may encounter difficulties when matching stereo images, thereby reducing the measurement precision. To overcome these problems, the paper proposes a new 3D - DIC simulation method that combines virtual stereo vision and image super - resolution reconstruction technology. The main objectives of this method are: - **Reduce hardware cost**: By using a single camera and additional optical components to achieve multi - view imaging, thus eliminating the need for multiple synchronous cameras. - **Eliminate camera synchronization error**: Virtual stereo vision can completely eliminate the synchronization error in traditional stereo vision, and is especially suitable for the measurement of dynamic objects. - **Improve measurement precision**: By applying image super - resolution reconstruction technology, compensate for the precision degradation caused by the loss of image resolution. By integrating optical simulation, mechanical simulation, 3D - DIC algorithms, and image super - resolution reconstruction models, the paper takes into account multiple factors in actual experiments and significantly improves the fidelity of the simulation. This method not only provides a new research path for existing researchers, but also enables researchers without expensive 3D - DIC hardware facilities to participate in relevant research.