Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Analysis of kinetics regimes in grain boundary self-diffusion

Point-defect avalanches mediate grain boundary diffusion

Grain-Boundary Kinetics: A Unified Approach

Coupled Grain Boundary and Surface Diffusion in A Polycrystalline Thin Film Constrained by Substrate

Phase-field model of grain boundary diffusion in nanocrystalline solids: Anisotropic fluctuations, anomalous diffusion, and precipitation

Solute diffusion in polycrystals with migrating grain boundaries: phase-field approach

Simulation of bulk and grain boundary diffusion phenomena in a high entropy CoCrFeMnNi alloy by molecular dynamics

Constrained Grain Boundary Diffusion in Thin Copper Films

Simulating hindered grain boundary diffusion using the smoothed boundary method

A coupled model of diffusional creep of polycrystalline solids based on climb of dislocations at grain boundaries

Grain boundary diffusion in CoCrFeMnNi high entropy alloy: kinetic hints towards a phase decomposition

Solute drag and dynamic phase transformations in moving grain boundaries

Calculation of GB Energies and Grain-Boundary Self-diffusion in Nickel and Verification of Borisov Relations for Various Symmetric Tilt Grain Boundaries

Effects of vacancy transport and surface adsorption on grain boundary migration in pure metals

Effect of recrystallization on diffusion in ultrafine grained Ni

Unusual acceleration and size effects in grain boundary migration with shear coupling

Reaction-controlled diffusion: Monte Carlo simulations

A classical equation that accounts for observations of non-Arrhenius and cryogenic grain boundary migration

On the Temperature Dependence of Grain Boundary Mobility

Diffusion-controlled reactions with non-Markovian binding/unbinding kinetics