First gold recovery from PCBs through en-thiosulfate leaching and selective adsorption with carbon

Yufang Li,Yunlong Chen,Futing Zi,Xianzhi Hu
DOI: https://doi.org/10.1007/s43153-024-00510-7
2024-10-15
Brazilian Journal of Chemical Engineering
Abstract:Eco-friendly gold extraction from printed circuit boards (PCBs) is highly attractive due to the increasing demand for gold in various fields. The conventional Cu 2+ -NH 3 - S 2 O 3 2− method for PCBs involves polluting NH3 gas and requires additional copper. This study explored a new eco-friendly alternative using ethylenediamine (en) and thiosulfate to extract gold from CPU (the PCB material used in this study). The results showed that 81% of gold in CPUs could be successfully leached out after 48 h, using 10 mM ethylenediamine and 0.2 M thiosulfate. Various analyses, including SEM, ICP, XPS, were conducted to further investigate the process. It was found that the metal in CPU was Au(0) → Ni(II) → Cu(0) from the outside to the inside, and possible gold leaching mechanism was related to the oxidation of Cu(en) 2 2+ produced from CPU's defective position and the presence of S 2 O 3 2− . As for Au(S 2 O 3 ) 2 3− recovery, different from our previous study, it is necessary to add a small amount of ethylenediamine (en) except for carbon and thiosemicarbazone (TSC); consequently, a gold adsorption efficiency of 99% was achieved. In summary, the leaching method proposed in this work solved the problem of NH 3 pollution of traditional one and achieves green, efficient, and selective gold adsorption from CPU leaching solution through a simple method, which is hopeful to replace the traditional unfriendly Cu-NH 3 - S 2 O 3 2− .
engineering, chemical
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