Effect of Bonding Time on Dissimilar Transient Liquid Phase (TLP) Bonding of IN939 to IN625 Superalloys: Microstructural Characterization and Mechanical Properties
Amirhossein Sadeghian,Seyyed Ehsan Mirsalehi,Farzam Arhami,Ahmad Malekan,Noritaka Saito,Kunihiko Nakashima
DOI: https://doi.org/10.1007/s11661-021-06176-x
2021-03-02
Metallurgical and Materials Transactions A
Abstract:The microstructure and mechanical properties of transient liquid phase (TLP) bonded joints between dissimilar precipitation hardened IN939 and solid solution hardened IN625 with a Ni-Cr-Si-Fe-B filler alloy were studied. The TLP bonding was conducted in different bonding times (<i>i.e.</i>, 15, 25, 35, 45, 60, and 90 minutes). Different phases, formed in the isothermally solidified zone (ISZ), on-cooling solidified zone, and diffusion affected zone (DAZ), were characterized using EDS, XRD, and EPMA analyses. A Ni-rich <i>γ</i> solid solution, CrB, and Ni<sub>3</sub>B were detected in the centerline of samples with incomplete isothermal solidification (<i>i.e.</i>, 15 and 25 minutes), formed by binary and ternary eutectic reactions. Raising the time of bonding boosted isothermal solidification, resulting in a joint without deleterious eutectic microconstituents in bonding times of 35 minutes and higher. Chromium-rich borides were discovered in the DAZ of IN939, while the IN625-DAZ side was composed of chromium-molybdenum-rich borides. The concentration of alloying elements in the ISZ experienced an increment by further raising the bonding time to 90 minutes, creating a more homogenous bond with increased ISZ microhardness and mechanical properties. The highest shear strength (~ 92 and ~ 77 Pct that of the IN939 and IN625, respectively) and failure energy were attained for the 90-minutes sample. The fracture mechanism was also switched from a brittle semi-cleave morphology to a more ductile dimple-like morphology by increasing the bonding time from 15- to 90-minutes.
materials science, multidisciplinary,metallurgy & metallurgical engineering