Abstract:This work reports a Kirigami‐inspired strategy to improve organohydrogels' strain sensitivity without sacrificing their robust mechanical stretchability and environmental stability, overcoming the dilemma of effectively achieving multifunctionalities in the existing conducting hydrogels. This Kirigami‐structured hydrogel sensing platform demonstrates superior sensing performance as remote monitoring, underwater interactive human–machine interface, and Morse code‐to‐speech translation system. Conductive hydrogels are compelling materials for the development of soft electronics; however, their essential attributes such as high sensitivity, excellent stretchability, and environmental stability have rarely been achieved simultaneously in one hydrogel. Herein, a Kirigami‐inspired strategy is proposed to improve organohydrogel sensitivity without sacrificing their mechanical stretchability and environmental stability . The organohydrogels with multiple interpenetrating networks are synthesized by introducing sodium alginate nanofibrils and conductive MXene nanoflakes into polymer double networks infiltrated with glycerol–water mixtures, featuring remarkable stretchability (>5000%), good sensitivity, and water retention (>30 days). The Kirigami structures are further applied to enhance strain sensitivity, achieving a gauge factor of 29.1, which is ≈5.5 times that of an unstructured organohydrogel. Using the Kirigami‐inspired sensors, a durable glove is developed for grabbing underwater objects through operating a robotic arm, demonstrating a subaqueous interactive human–machine interfacing.Meanwhile, by integrating the wearable sensor with a machine learning algorithm, a wearable Morse code intelligent recognition system is demonstrated, enabling real‐time conversion of Morse code signs into speech with superior recognition accuracy (>99%) and fast response time (≈17 ms). This work offers a new route to synthesize highly sensitive, stretchable, and extremely tolerant organohydrogels, providing a promising platform for next‐generation soft electronics.

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