An adaptive genetic algorithm optimize neural networks approach for wafer dicing saw quality prediction

Jun Shi,Sihan Du,Yunpeng Shi,Weifeng Cao,Lintao Zhou
DOI: https://doi.org/10.1007/s00170-022-10472-0
IF: 3.563
2022-11-22
The International Journal of Advanced Manufacturing Technology
Abstract:In the manufacturing of semiconductor devices, dicing is a crucial step. The price of semiconductor components is directly impacted by the dicing quality. However, the current inspection of dicing quality is done after the dicing is completed which leads to a decrease in dicing efficiency and an increase in cost. To solve these problems, this paper establishes a model that exploits adaptive genetic algorithms to optimize back propagation neural networks (AGA-BPNN) to predict the dicing quality. In this paper, expert experience and principal component analysis (PCA) are used to process the data that the method learns and analyzes. The model can predict dicing quality in faster time and obtain 91.76% accuracy through experimental verification on the ADT 8230. This method can be used during machine operation; when the predicted value exceeds the rated value, it will trigger an alarm to prevent additional product loss, thus improving the efficiency of production.
engineering, manufacturing,automation & control systems
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