Abstract:Over the past few decades, electronics have become commonplace in government, commercial, and social domains. These devices have developed rapidly, as seen in the prevalent use of system-on-chips rather than separate integrated circuits on a single circuit board. As the semiconductor community begins conversations over the end of Moore’s law, an approach to further increase both functionality per area and yield using segregated functionality dies on a common interposer die, labeled a System in Package (SiP), is gaining attention. Thus, the chiplet and SiP space has grown to meet this demand, creating a new packaging paradigm, advanced packaging, and a new supply chain. This new distributed supply chain with multiple chiplet developers and foundries has augmented counterfeit vulnerabilities. Chiplets are currently available on an open market, and their origin and authenticity consequently are difficult to ascertain. With this lack of control over the stages of the supply chain, counterfeit threats manifest at the chiplet, interposer, and SiP levels. In this article, we identify counterfeit threats in the SiP domain, and we propose a mitigating framework utilizing blockchain for the effective traceability of SiPs to establish provenance. Our framework utilizes the Chiplet Hardware Security Module to authenticate a SiP throughout its life. To accomplish this, we leverage SiP information including electronic chip identification of chiplets, combating die and IC recycling sensor information, documentation, test patterns and/or electrical measurements, grade, and part number of the SiP. We detail the structure of the blockchain and establish protocols for both enrolling trusted information into the blockchain network and authenticating the SiP. Our framework mitigates SiP counterfeit threats including recycled, remarked, cloned, overproduced interposer, forged documentation, and substituted chiplet while detecting of out-of-spec and defective SiPs.

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