Abstract:As one of the mainstream physical implementation methods for quantum computing, superconducting qubit has gained much attention in recent years. However, commonly-used wire-bonding technique for signal transporting between external classical processor and internal qubits in lateral circuit plane cannot support enough number of physical qubits to build up computationally-useful, fault-tolerant, error corrected quantum computer due to signal crosstalk and decoherence effect caused by bonding wire. Therefore, advanced packaging technology in semiconductor industry such as flip-chip has been adopted to replace conventional wire-bonding technique, extending the vertical dimension to further improve the qubit integration density. In this work, we have completely demonstrated a fabrication process of flip-chip bonding scheme which is compatible with superconducting qubits, obtaining high mechanical reliability, satisfying DC/microwave transporting performance and superior bondability without introducing lossy material. Due to cryogenic working requirement of qubit, the constituent materials are required to possess superconducting characteristic, which is uncommon in conventional IC package.Herein, we construct functional test vehicles using 50-μmdiameter microbumps in 100 μm pitch based on Al/TiN/In/Au symmetric flip-chip bonding structure, which is respectively corresponding to RDL, diffusion barrier, bump, and antioxidant layer. Based on above basic structure, we have fabricated daisy chain structure for measurement of DC resistance change during cool-down process, transmission line structure for evaluation of microwave transporting performance and sealing ring structure for hermeticity test.X-Ray, step profiler and confocal microscope system show that high-uniformity bumps are all arranged in correct position without obvious defects and short connection between adjacent bumps. Die shear test is conducted exhibiting an average strength of 12.9 MPa, strong enough for holding and further processing. Cross-section morphology are inspected by FIB and SEM, showing a clearly layered microstructure without obvious defects. Standard helium leak test is carried out using overall 20 sealing ring samples, showing eligible leakage rate based on MIL-STD-883 standard, which opens up possibilities for ultra-high vacuum quantum package which will be probably applied for environmental protection and electromagnetic shield in future 3D packaging architecture of superconducting qubits. Electrical test results show reasonable microwave S21 curve with certain performance of superconducting characteristic within operating frequency range of qubits under cryogenic temperature and shows certain degree of resistance drop during cool-down process. These results have systematically demonstrated the feasibility of implementing scalable superconducting quantum processors in higher integration density through indium-based flip-chip technique.

Low-loss interconnects for modular superconducting quantum processors

Low-loss liquid metal interconnects for superconducting quantum circuits

A high-efficiency plug-and-play superconducting qubit network

Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device

Tunable coupling of widely separated superconducting qubits: A possible application towards a modular quantum device

Qubit compatible superconducting interconnects

Multiplexed quantum transport using commercial off-the-shelf CMOS at sub-kelvin temperatures

Realization of high-fidelity perfect entangler between remote superconducting quantum processors

Mechanically-intermixed indium superconducting connections for microwave quantum interconnects

Nb-based superconducting silicon interconnect fabric for cryogenic electronics

Scalable interconnection using a superconducting flux qubit

Modular quantum processor with an all-to-all reconfigurable router

Superconducting routing platform for large-scale integration of quantum technologies

Modular superconducting-qubit architecture with a multichip tunable coupler

Quantum computing with many superconducting qubits

Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

Scalable Method for Eliminating Residual Interaction between Superconducting Qubits

High-Density Qubit Wiring: Pin-Chip Bonding for Fully Vertical Interconnects

Low Loss Multi-Layer Wiring for Superconducting Microwave Devices

Deterministic quantum teleportation between distant superconducting chips