Research Progress on Bonding Wire for Microelectronic Packaging

Hongliang Zhou,Yingchong Zhang,Jun Cao,Chenghao Su,Chong Li,Andong Chang,Bin An
DOI: https://doi.org/10.3390/mi14020432
IF: 3.4
2023-02-12
Micromachines
Abstract:Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.
chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
What problem does this paper attempt to address?
The problem that this paper attempts to solve is the limitations of traditional gold (Au) bonding wires in terms of cost, performance development, etc. in microelectronic packaging with the increasing demand for miniaturization, high - density and high - performance. Specifically: 1. **Cost issue**: Due to the sharp increase in the price of gold, the cost of using gold bonding wires has increased significantly, which has prompted the industry to look for more economical alternative materials, such as copper (Cu) and silver (Ag) bonding wires. 2. **Performance issue**: Although gold bonding wires have good chemical stability, reliable manufacturing and operating performance, their thermal stability at high temperatures and the ability to resist the formation of inter - metallic compounds (IMCs) are limited, which restricts their application in miniaturized electronic products. 3. **Reliability issue**: Gold bonding wires are prone to bonding collapse, tail breakage and other problems in high - density and fine - pitch bonding, which affects their reliability in high - density and fine - pitch applications. In order to address the above problems, the paper reviews the research progress of copper and silver as alternative materials for gold bonding wires, discusses their advantages and challenges in manufacturing processes and reliability, as well as future development trends. By comparing the basic properties and applications of gold, copper and silver bonding wires, the paper aims to provide a technical reference for researchers and engineers in the field of microelectronic packaging.