The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites

Ruijun Wang,Jingbo Liu,Tianshi Wang,Xiaolu Pang,Lining Xu,Lijie Qiao
DOI: https://doi.org/10.1007/s11665-023-07894-6
IF: 2.3
2023-02-09
Journal of Materials Engineering and Performance
Abstract:In this study, we examined the effect of process flow on the bonding properties of carbon fiber/copper composites. The carbon fiber surface was first subjected to hot air oxidation degumming treatment, and then plasma treatment was performed after filling a vacuum environment with Ar. The magnetron sputtering process was used, and the carbon fiber/copper composite was prepared by selecting titanium as the intermediate transition layer and copper as the plating metal. The experimental results indicated that the peeling strength of copper/carbon fiber interface was highest when the plasma was treated for 30 s. As a transition layer, titanium plays a vital role in the peeling strength of copper/carbon fiber, and forming a Ti-C bond improves the peeling strength. In the range of 20-150 V, the peeling strength of carbon fiber/copper increased with the increase of titanium and copper substrate bias voltage. This is because the diffusion and adhesion of titanium and copper atoms fill the pores and improve compactness.
materials science, multidisciplinary
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