Abstract:The escalating demands of high-frequency applications demands the development of dielectric materials with low relative permittivity (dielectric constant) for efficient signal propagation. In light of the prevailing challenges and barriers, this article delves into the intricate mechanisms underlying the dielectric constants of low-k polymer composites while highlighting the challenges associated with their utilization. This study discusses the importance of consistent performance across various frequencies, processing conditions, and filler-matrix compatibility in dielectric properties. It also discusses the impact of thermal conductivity on dielectric behavior, the challenges of controlling porosity, moisture reduction implications, and the significance of haze in low-k and loss dielectric materials for high-frequency applications. The review also explores the impact of scattering and light transmission on material performance. Finally, this study outlines the utilization of various low-k polymer composites, including Polytetrafluoroethylene (PTFE), Polyimide (PI), Polyphenylene oxide (PPO), Polyethylene (PE), Polypropylene (PP), Polyvinylidene difluoride (PVDF), Cyclic Olefin Copolymer (COC), Perfluoroalkoxy's (PFA), & Poly(benzoxazoles) (PBO) to highlight their potential applications in high-frequency scenarios. By comprehensively investigating the dielectric constant and related challenges in low-k polymer composites, this study article aims to contribute to understanding and advancing materials for high-frequency applications. The insights provided herein offer valuable guidance for researchers, engineers, and manufacturers in the ongoing pursuit of efficient and reliable dielectric materials for the modern high-frequency electronic packaging industries.

Low-K LTCC Dielectrics: Novel High-Q Materials for 5G Applications

Low-temperature Co-Fired Ceramics with High Thermal Expansion and Reliability for Millimeter-Wave Antennas

Low loss dielectric materials for LTCC applications: a review

High Permittivity and Low Loss Microwave Dielectrics Suitable for 5G Resonators and Low Temperature Co-Fired Ceramic Architecture

A low-sintering temperature microwave dielectric ceramic for 5G LTCC applications with ultralow loss

Low‐temperature‐sintered MgO‐based Microwave Dielectric Ceramics with Ultralow Loss and High Thermal Conductivity

Low temperature sintered MgO–based microwave dielectric ceramics with ultra‐low loss and high thermal conductivity

MgF2-based Microwave Dielectric Ceramics with Ultra-Low Sintering Temperature and High Thermal Expansion Coefficient

Low-loss dielectric ceramic materials and their properties

Emerging magnetodielectric materials for 5G communications: 18H hexaferrites

Low permittivity cordierite-based microwave dielectric ceramics for 5G/6G telecommunications

Low-permittivity BaCuSi4O10-based Dielectric Ceramics: an Available Solution to Connect Low Temperature Cofired Ceramic Technology and Millimeter-Wave Communications

MgF 2 -based microwave dielectric ceramics with ultra-low sintering temperature and high thermal expansion coefficient

Polymer-based low dielectric constant and loss materials for high-speed communication network: Dielectric Constants and Challenges

An ultralow-k dielectric derived from a fluorinated polybenzoxazole composite film with yolk–multishell mesoporous silica nanostructures

High Q×f values of Zn-Ni co-modified LiMg0.9Zn0.1-xNixPO4 microwave dielectric ceramics for 5G/6G LTCC modules

Li2WO4 Composite Ba3Ti4Nb4O21 Microwave Dielectric Ceramics with Near-Zero Temperature Coefficient and Low-Temperature Sintering for 5G Communication Devices

High Permittivity and Low-Loss Millimeter-wave Dielectric Ceramics

Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies

SrFe 12 O 19 based ceramics with ultra-low dielectric loss in the millimetre-wave band University of Chester Digital Repository

Low-Loss, Temperature-Stable, and Li-Enriched Li2.12ZnTi3O8 Dielectric Ceramics for LTCC Applications with V2O5 Addition