Hybrid Microsupercapacitors with Vertically Scaled 3D Current Collectors Fabricated Using a Simple Cut‐and‐Transfer Strategy
Qiu Jiang,Narendra Kurra,Chuan Xia,Husam N. Alshareef
DOI: https://doi.org/10.1002/aenm.201601257
IF: 27.8
2016-01-01
Advanced Energy Materials
Abstract:DOI: 10.1002/aenm.201601257 MnO2 and activated carbons employing binders and conductive additives, which are electrochemically inactive, often have poor electrochemical performance due to limited diffusion kinetics of electrolyte ions. In the case of thick block of electrode materials, electrolyte permeability is hindered and charge extraction becomes inefficient, which limits the final electrochemical performance of such devices. Therefore, compared to planar current collectors, ultrathick current collectors such as Ni foam or carbon fiber cloth are the best choice in terms of direct growth of electroactive materials by various methods on 3D collectors. This is because their intrinsic macroporous nature helps maximize active material loading, while providing easy access to the electrolyte ions, leading to faster reaction kinetics and hence improved electrochemical performance. For example, Ni foam has been extensively used in direct growth of metal oxides and sulfides by hydrothermal method[8,9] resulting in excellent specific capacity values. However, there are no reports on fabrication of coplanar electrochemical devices (e.g., microsupercapacitors) based on Ni foam patterned collectors. Since Ni foam is bulky (thickness of 500–1200 μm) with porous texture, it is not amenable to patterning by conventional photolithography. Here, we propose a new strategy for patterning macroscopic ultrathick 3D current collectors in the form of interdigitated electrodes by laser machining. A robust and simple approach was developed to pattern 3D current collectors as frameworks for maximum electroactive material loading with optimal electrochemical performance in a given footprint area. This platform can be used to evaluate various active materials in coplanar hybrid (asymmetric) configuration, which is typically more difficult to fabricate in comparison to symmetric configuration. As a proof of concept, a hybrid device is demonstrated, employing Faradaic NiCo2S4 as a positive electrode material and electrochemical double-layer carbon nanofiber (CNF) as a negative electrode, both of which were directly grown on Ni foam interdigital electrodes by hydrothermal and chemical vapor deposition methods, respectively. We have demonstrated the fabrication of the hybrid coplanar device with remarkable areal capacity in a given footprint area with high operating voltage window in aqueous and gel electrolytes. Indeed, this hybrid prototype device exhibits superior energy density of 200 μWh cm−2 compared to state-of-the-art microsupercapacitors (1–40 μWh cm−2), with higher power density when compared to thin-film batteries and microbatteries at comparable energy density. Laser engraving is a direct patterning method, involving neither photoresists nor complicated multistep processing. Thanks to the energetic laser beam which has the ability to cut the metals locally, desired object shapes for many applications can On-chip energy storage devices, including thin film batteries and microsupercapacitors, are being developed as micropower (μ-power) units for portable electronic devices, self-powered systems, and internet-of-things applications.[1] However, thin film and 3D microbatteries often suffer from poor rate performance and cycle life. In comparison, microsupercapacitors have shown promise as micropower sources with high power density, fast charge–discharge rates, and long cycle life, but often with limited energy density. The trade-off between the energy and power densities can be improved by proper selection of electrode materials, current collector design, and device configuration. In that respect, coplanar hybrid microsupercapacitors with vertically scaled, 3D porous current collectors may be a key strategy in enhancing areal energy and power densities. Conventional microfabrication techniques have been widely employed in fabricating various state-of-the-art carbon based microsupercapacitors.[2,3] Further, pseudocapacitive materials such as metal oxides/hydroxides,[4] sulfides,[5] and conducting polymers[6] were used in enhancing the capacity and energy density of on-chip electrochemical devices. In practice, key electrochemical performance metrics of on-chip energy storage rely on the energy and power density in a given footprint area.[1] However, microsupercapacitors fabricated by conventional photolithography often suffer from limited mass loadings of active materials in a given footprint area (<0.1 mg cm−2). One of the approaches is to deposit thicker electrode films to achieve higher areal energy density, but thicker electrodes may suffer from poor mechanical stability, poor adhesion, and high resistivity, which could impede the electron/ion transport, resulting in mediocre power performance of the device. The technological trend to achieve high areal performance is to transition from 2D to 3D architecture, where an optimal mass loading of active material can be achieved in a given footprint area. For instance, silicon-based microelectromechanical systems (MEMS) technology was employed in fabricating various 3D microsupercapacitors. Further, 3D arrays of Si (30 μm thick) and SU-8 (100 μm thick) were fabricated as scaffolds for increasing loading of active materials compared to 2D collector counterparts.[7] However, thicker coatings (50–150 μm) of