Abstract:This paper is concerned about an investigation of mechanical and electrical conductive properties of carbon fiber fabric reinforced shape memory polymer composite (SMPC). The shape memory polymer (SMP) is a thermoset styrene-based resin. SMP is a promising smart material, which is under intensive investigation at present. Its primary advantages over other smart materials are the high strain capacity (200% reversible strain), low density and low cost etc.. But its major drawbacks are low strength, low modulus and low recovery stress. So the fiber reinforced SMPC was naturally considered to be investigated in this paper, which may overcome the disadvantages mentioned above. The investigation was conducted with experimental methods: Dynamic Mechanical Analyzer (DMA), static and mechanical cycle loading tests, microscope observation of microstructural deformation mechanism, conductivity and shape recovery tests. Results indicated that SMPC showed higher glass transition temperature (T-g) than neat SMP and improved the storage modulus, bending modulus, strength and resistance against relaxation and creep. Both fiber microbuckling and fracture of SMPC were observed after the static 3-ponit bending test at the constant room temperature. SMPC showed favorable recovery performances during thermomechanical cycles of the bending recovery test and the fiber microbuckling was obvious. Moreover, the conductive SMPC of this study experienced low electrical resistivity and performed a good shape memory effect during numerous thermomechanical cycles.

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