Abstract:This review highlights the latest progress and trends, beginning with the development of advanced materials for encapsulations for flexible bioelectronics and the invention of new schemes for multifunctional flexible bio‐integrated electronics. By dividing this review into wearable and implantable electronics sections, it will help readers make appropriate choices and understand the use of materials and enable the development of various application fields. Recently, bioelectronic devices extensively researched and developed through the convergence of flexible biocompatible materials and electronics design that enables more precise diagnostics and therapeutics in human health care and opens up the potential to expand into various fields, such as clinical medicine and biomedical research. To establish an accurate and stable bidirectional bio‐interface, protection against the external environment and high mechanical deformation is essential for wearable bioelectronic devices. In the case of implantable bioelectronics, special encapsulation materials and optimized mechanical designs and configurations that provide electronic stability and functionality are required for accommodating various organ properties, lifespans, and functions in the biofluid environment. Here, this study introduces recent developments of ultra‐thin encapsulations with novel materials that can preserve or even improve the electrical performance of wearable and implantable bio‐integrated electronics by supporting safety and stability for protection from destruction and contamination as well as optimizing the use of bioelectronic systems in physiological environments. In addition, a summary of the materials, methods, and characteristics of the most widely used encapsulation technologies is introduced, thereby providing a strategic selection of appropriate choices of recently developed flexible bioelectronics.

Ultra‐Thin Flexible Encapsulating Materials for Soft Bio‐Integrated Electronics

Implantable Wet‐Adhesive Flexible Electronics with Ultrathin Gelatin Film

Advances in Wearable and Implantable Bioelectronics for Precision Medicine

Softening implantable bioelectronics: Material designs, applications, and future directions

Barrier Materials for Flexible Bioelectronic Implants with Chronic Stability—current Approaches and Future Directions

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Material Innovation and Mechanics Design for Substrates and Encapsulation of Flexible Electronics: a Review.

Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces

Flexible Electronics with Dynamic Interfaces for Biomedical Monitoring, Stimulation, and Characterization

Multifunctional porous soft bioelectronics

Flexible Bioelectronics for Physiological Signals Sensing and Disease Treatment

Introductory Review of Soft Implantable Bioelectronics Using Conductive and Functional Hydrogels and Hydrogel Nanocomposites

Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics

Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants

Sustainable Natural Bio‐Origin Materials for Future Flexible Devices

Materials and Devices for Biodegradable and Soft Biomedical Electronics

Polymer-based Flexible Bioelectronics

Wearable and Implantable Soft Bioelectronics Using Two-Dimensional Materials

Ultrathin, Transferred Layers of Thermally Grown Silicon Dioxide As Biofluid Barriers for Biointegrated Flexible Electronic Systems

Recent advances in the development of flexible dye-sensitized solar cells: Fabrication, challenges and applications- A Review

Skin‐Mountable Functional Electronic Materials for Bio‐Integrated Devices