Abstract:Purpose The purpose of this paper is to investigate the influence of silver nanoparticle additions on the wetting properties of Sn‐Ag‐Cu (SAC) solder paste. In this investigation, the basic solder paste contained 85 wt.% of commercial Sn 96.5 Ag 3 Cu 0.5 powder (with the particle sizes in the range of 20‐38 μ m) and 15 wt.% of self‐prepared middle activated rosin flux. To this paste was added 0.5, 1, 2 and 4 wt.% of self‐prepared silver nano‐powders of different grain sizes (from 9 to 138 nm). After the pastes had stabilized, their wetting properties were tested. The main goal of these investigations was to improve the wetting properties of SAC solder paste and to find correlations between the results of the wetting of solder paste with nanoparticles on the copper substrate with the microstructure of the solder joints. Design/methodology/approach The following methods were applied for the wetting solder paste investigation: spreading on the copper substrate, contact angle measurement on the copper and wetting on a FR‐4 laminate double sided with an 18‐ μ m thick copper foil. The investigations were performed at temperatures of 220, 230, 240 and 250°C. Cross‐sectioning was performed on the solder paste after reflow on the copper substrate. For the microstructural analysis of the “nano” modified solder joints obtained at 250°C, standard metallographic procedures were applied. Changes in the microstructure, the thickness of the inter‐metallic compounds (IMCs) and their chemical compositions were observed by means of scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). Findings As expected, a higher silver nanoparticle addition to the SAC solder paste resulted in better wetting properties on copper. The results indicated the possibility of an improvement of the reflow soldering process by using SAC solder paste with silver nanoparticles and by lowering its soldering temperature. An improvement was also observed in the wettability with a decrease in the silver nanoparticle grain size. Also, the wettability proceeded at a lower temperature (20°C lower) than that for the SAC paste, without the nano‐additives. For the 4 per cent silver nanoparticle addition, Ag 3 Sn star‐like IMCs were also found, which grew with the lowering of the silver nanoparticle grain size. Research limitations/implications Further studies are necessary for confirmation of the practical application, especially of the mechanical properties, as well as the reliability properties of the solder joints, for the chosen solder paste with silver nanoparticles. Practical implications Taking into account the wetting data, the best results of the “nano” SAC solder pastes were obtained for the highest addition of the silver nanoparticles. It was found that the spreading on copper was higher and the contact angles were lower for the SAC solder paste with 4 per cent (by wt.) of 138‐nm grain size silver nanoparticles. A comparison of SAC solder pastes with a 4 per cent silver nanoparticle addition but of a different grain size (138‐9 nm), suggested a further improvement in wetting properties with lowering of the silver nanoparticle grain size. The results suggested the possibility of an improvement in the reflow soldering process by using SAC solder paste with silver nanoparticles and by lowering its soldering temperature. Originality/value Spreading, wetting and contact angle measurement methods were used for the wetting determination of the SAC solder paste with the silver nanoparticles on copper under the same temperature conditions. Also, the microstructure of the solder joints obtained at 250°C was determined with the use of SEM and EDS methods. The results obtained made it possible to draw conclusions regarding the correlation between the output of the wetting results and the amount and the grain size of the added silver nanoparticles, and also the microstructure and thickness of the IMCs of the “nano” solder joints.

Wettability and Rheological Behavior of Low Ag Lead-Free SAC/Graphene and Cobalt-Graphene Nanocomposite Solder Paste

Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder

Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Sn–3.0Ag–0.5Cu Nanocomposite Solders Reinforced by Graphene Nanosheets

The Study on Reliability of Ni-coated Graphene Doped SAC305 Lead-Free Composite Solders under High Current-Density Stressing

Wettability of Sn-Bi and Sn-Ag-Cu Lead-Free Solder Pastes on Electroplated Co-P Films

Wettability and Shear Strength of SAC305 Based Composite Solder with Co-Doping X (ni or Al2O3) and CNTs Reinforcements

Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Effect of Cu6Sn5 Nanoparticles Addition on Properties of Sn3.0Ag0.5Cu Solder Joints

In Situ Study of Electrochemical Migration of Sn3Ag0.5Cu Solder Reinforced by Cu 6 Sn 5 Nanoparticles

EBSD characterization of graphene nano sheet reinforced Sn–Ag solder alloy composites

The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint

The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder

Synthesis and Characterization of Nano-Composite Lead-Free Solder

The impact of paste alloy, paste volume, and surface finish on solder joint

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn–Ag–Cu composite solder joints