Abstract:The bottleneck in modern thermoelectric power generation and cooling is the low energy conversion efficiency of thermoelectric materials. The detrimental effects of lattice phonons on performance can be mitigated, but achieving a high thermoelectric power factor remains a major problem because the Seebeck coefficient and electrical conductivity cannot be jointly increased. The conducting electron gas in thermoelectric materials is the actual working fluid that performs the energy conversion, so its properties determine the maximum efficiency that can theoretically be achieved. By relating the thermoelastic properties of the electronic working fluid to its transport properties (considering noninteracting electron systems), we show why the performance of conventional semiconductor materials is doomed to remain low. Analyzing the temperature dependence of the power factor theoretically in 2D systems and experimentally in a thin film, we find that in the fluctuation regimes of an electronic phase transition, the thermoelectric power factor can significantly increase owing to the increased compressibility of the electron gas. We also calculate the ideal thermoelectric conversion efficiency in noninteracting electron systems across a wide temperature range neglecting phonon effects and dissipative coupling to the heat source and sink. Our results show that driving the electronic system to the vicinity of a phase transition can indeed be an innovative route to strong efficiency enhancement, but at the cost of an extremely narrow temperature range for the use of such materials, which in turn precludes potential development for the desired wide range of thermoelectric energy conversion applications.

Thermoelectric conversion efficiency of a two-dimensional thermoelectric plate of finite-size with a center crack

Effect of cracking on the thermoelectric conversion efficiency of thermoelectric materials

Effective Thermoelectric Conversion Properties of Thermoelectric Composites Containing a Crack/hole

Dynamic Response of Cracked Thermoelectric Materials

Multiple cracks in thermoelectroelastic bimaterials

Stress analysis for a lip-shaped crack in a thermoelectric plate under combined electrical and thermal loadings

Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

Thermoelectric and Stress Fields for a Cracked Thermoelectric Media Based on the Electric Field Saturation Model

A Penny-Shaped Crack in an Infinite Linear Transversely Isotropic Medium Subjected to Uniform Anti-Symmetric Heat Flux: Closed-form Solution

A Penny-Shaped Crack in Transversely Isotropic Magneto-Electro-thermo-elastic Medium Subjected to Uniform Symmetric Heat Flux

Thermoelastic Cracked Plates Carrying Nonstationary Electrical Current

Cracking and Thermal Shock Resistance of a Bi2Te3 Based Thermoelectric Material

Theoretical Model of Fatigue Crack Growth of a Thermoelectric Pn-Junction Bonded to an Elastic Substrate

Fracture of Thermoelectric Materials: an Electrical and Thermal Strip Saturation Model

Thermo-elastic Cracked Cylindrical Shells and Plates Carrying Non-stationary Electrical Current

Failure Prediction of an Airfoil-Type Crack in Thermoelectric Coupling Materials

The thermoelectric conversion efficiency problem: Insights from the electron gas thermodynamics close to a phase transition

Fracture Behavior and Thermal Shock Resistance Analysis of Thermoelectric Material Plates and Shells under Thermal and Electric Shocks

Transient response of interface crack-containing plates during non-Fourier heat conduction processes based on peridynamic Green-Naghdi-III model

Effective moduli for thermopiezoelectric materials with microcracks

Crack Growth Prediction of an Inclined Crack in a Half-Plane Thermopiezoelectric Solid