Abstract:Scanning electron microscope, atomic force microscope and other equipment play an important role in the fields of topography restoration and detection. However, these devices are generally used in nanometer-scale measurement scenarios. For wafer topography quality control scenarios ranging from microns to hundreds of microns, these technologies have problems such as high cost and slow detection speed. Therefore, developing new, low-cost, and high-precision methods is necessary. To address this problem, a wafer surface reconstruction framework is proposed based on the shape-from-focus principle. In view of the characteristics of the large area and micro-small height of the wafer, to solve the limitations of the existing shape from focus framework, which is generally based on a single field, we created a multi-field image sequence rapid acquisition system and proposed the use of pulse control methods to achieve rapid acquisition of large area images. On the other hand, this paper proposes a dual filtering framework combining the Levy flight filtering principle with the SOR algorithm in point cloud filtering to achieve a balance between smoothing the depth map and maintaining the detailed structure, reducing the impact of noise, and improving the morphology restoration accuracy. To avoid splicing seams between fields, the progressive detection multifield stitching technique is used to complete large-area depth data stitching. Experiments were conducted on both synthetic and real objects to verify the effectiveness of the proposed method. In terms of synthesized images, the accuracy of the three methods significantly improved after applying the proposed method framework. After applying the Tenenbaum method framework, its correlation and peak signal-to-noise ratio improved by 7.5% and 38.2%, respectively, and its root mean square error was reduced by 40.7%. The excellent accuracy reconstruction results of the proposed method was verified through accuracy evaluation experiments. The height errors of the three methods used were all higher than . However, after using the proposed method framework, the maximum error was only . The experimental results indicated that this method overcomes the area limitation of traditional SFF and is suitable for applying wafer surface morphology measurements.

Microscopic 3D reconstruction based on point cloud data generated using defocused images

Three Dimensional Surface Reconstruction Based on Light Field Imaging

Three Dimensional Reconstruction Using a Lenslet Light Field Camera

Extended Depth of Field Reconstruction with Complex Field Estimation

Precise 3d reconstruction from a single image

Monocular Microscopic Image 3D Reconstruction Algorithm Based on Depth from Defocus with Adaptive Window Selection

Multi-slice Ptychographic Imaging with Multistage Coarse-to-fine Reconstruction

3-D Ultrasonic Image Reconstruction in Frequency Domain Using a Virtual Transducer Model.

Outdoor Scene 3D Reconstruction from Multiple Point Cloud

3D reconstruction based on wavelet pyramid image fusion algorithm for digital microscope

Depth Estimation Method for Monocular Camera Defocus Images in Microscopic Scenes

DP-MVS: Detail Preserving Multi-View Surface Reconstruction of Large-Scale Scenes

Rapid Image Deconvolution and Multiview Fusion for Optical Microscopy.

Perspective-consistent multifocus multiview 3D reconstruction of small objects

Real-Time 3D Reconstruction of Thin Surface Based on Laser Line Scanner

Real-Time 3d Image Fusion Based on Wavelet Transform in Microscope Auto-Focusing System

A Deep-Learning-based Workflow to Deal with the Defocusing Problem in High-Throughput Experiments

Deep-learning Based Single-Shot 3D Reconstruction with Simulated Color-Crosstalk and Randomized Extrinsics

Automatic 3D Reconstruction of SEM Images Based on Nano-robotic Manipulation and Epipolar Plane Images.

Wafer Surface Reconstruction Based on Shape From Focus

Defocused image restoration method based on micro-nano scale