Impact of Fe Material Thickness on Performance of Raised Source Overlapped Negative Capacitance Tunnel Field Effect Transistor (NCTFET)

Amandeep Singh,Sanjeet Kumar Sinha,Sweta Chander
DOI: https://doi.org/10.1007/s12633-022-01696-6
IF: 3.4
2022-01-22
Silicon
Abstract:In this work, Raised Source gate overlapped negative capacitance tunnelling field effect transistor (NC-TFET) is optimized for the first time to suppress the ambipolarity of TFET and enhance ION current to obtain stepper subthreshold slope and low power dissipation. As the proposed device structure alters the energy band of the heterojunction formed between source and channel, it has lower band to band tunnelling rate in comparison with normal NCTFET, which in turns reduces the static power consumption of TFET digital circuit. In this work, N+ doped drain is used to make a reverse p-n heterojunction with P+ doped Ge Source that reduces the leakage current path off effectively. The optimized NCTFET exhibits the sub-threshold swing of 53.7 mV/dec and ION/IOFF > 109 for five decades of current with BaTiO3 Fe material and thickness of 3 nm. The simulation results reveal that Raised Source NC-TFET performs better than normal NCTFET in terms of Band to Band Generation, Electrostatic Potential and steepness of sub threshold slope without adding any fabrication complexity, which is an importance factor for low power applications and future experimental investigation.
materials science, multidisciplinary,chemistry, physical
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