Abstract:Terahertz waves offer numerous advantages for the nondestructive detection of hidden objects/defects in materials, as they can penetrate through most optically-opaque materials. However, existing terahertz inspection systems are restricted in their throughput and accuracy (especially for detecting small features) due to their limited speed and resolution. Furthermore, machine vision-based continuous sensing systems that use large-pixel-count imaging are generally bottlenecked due to their digital storage, data transmission and image processing requirements. Here, we report a diffractive processor that rapidly detects hidden defects/objects within a target sample using a single-pixel spectroscopic terahertz detector, without scanning the sample or forming/processing its image. This terahertz processor consists of passive diffractive layers that are optimized using deep learning to modify the spectrum of the terahertz radiation according to the absence/presence of hidden structures or defects. After its fabrication, the resulting diffractive processor all-optically probes the structural information of the sample volume and outputs a spectrum that directly indicates the presence or absence of hidden structures, not visible from outside. As a proof-of-concept, we trained a diffractive terahertz processor to sense hidden defects (including subwavelength features) inside test samples, and evaluated its performance by analyzing the detection sensitivity as a function of the size and position of the unknown defects. We validated its feasibility using a single-pixel terahertz time-domain spectroscopy setup and 3D-printed diffractive layers, successfully detecting hidden defects using pulsed terahertz illumination. This technique will be valuable for various applications, e.g., security screening, biomedical sensing, quality control, anti-counterfeiting measures and cultural heritage protection.

Nondestructive inspection of packaged microcircuits by aperture-type terahertz near-field imaging

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Nondestructive Evaluation of IC Package by Millimeter-Wave

Nondestructive inspection of delamination in IC packages by high-frequency microwaves

Wavenumber-Domain Fast Reconstruction Technique Using Ultrasonic Scanning for Transverse Wave Imaging

Microwave Nondestructive Detection of Delamination in IC Packages Utilizing Open-Ended Coaxial Line Sensor

NDI of Delamination in IC Packages Using Millimeter-Waves

Cylindrical Aperture Three-dimensional Synthetic Aperture Imaging with Pulsed Terahertz Waves

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Rapid sensing of hidden objects and defects using a single-pixel diffractive terahertz sensor

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A Terahertz 3D Imaging Method for Complex Internal Structure of Object

A Terahertz 3-D Imaging Method for Complex Internal Structure of Object

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Experimental study on the characteristics of near‐field distribution of chips based on nano‐diamond quantum magnetometer