Grain Boundary Processes in Strengthening, Weakening, and Superplasticity

Atul H. Chokshi

DOI: https://doi.org/10.1002/adem.201900748

IF: 3.6

2019-12-01

Advanced Engineering Materials

Abstract:Grain boundaries provide strength to materials at low temperatures by impeding slip transfer and they weaken materials at high temperatures by intergranular creep processes such as grain boundary sliding and diffusion creep. At very fine nanocrystalline grain sizes of <10 nm, it is possible to observe grain boundary weakening rather than strengthening at room temperatures. Superplastic flow is observed in a wide range of materials, but the common phenomenology of a high strain rate sensitivity and extensive grain boundary sliding may arise from varying importance of grain boundary sliding accommodated by dislocations, diffusion creep and interface controlled diffusion creep. Thus, superplasticity in metals and ceramics involves grain boundary sliding with dislocation accommodation and interface controlled diffusion creep, respectively. It is recognized that grains can retain their equiaxed shaped shapes during diffusion creep by grain switching and grain growth. Ultrafine grained and nanocrystalline materials with a high strain rate sensitivity of >0.3 deform with a large contribution of grain boundary sliding contribution to total strain of ~40–80%. There are a limited number of studies showing superplasticity in fine grained high entropy alloys, involving grain boundary sliding accommodated by dislocations.This article is protected by copyright. All rights reserved.

materials science, multidisciplinary