Superconformal Deposition of Au in a Sulfite Electrolyte

Daniel Josell,Thomas P. Moffat

DOI: https://doi.org/10.1149/ma2013-02/38/2393

2013-10-27

ECS Meeting Abstracts

Abstract:Abstract not Available.

What problem does this paper attempt to address?

Superconformal Electrodeposition Using Derivitized Substrates

T. P. Moffat,D. Wheeler,C. Witt,D. Josell

DOI: https://doi.org/10.1149/1.1521290

2002-01-01

Abstract:This paper demonstrates superconformal electrodeposition of copper in trenches using a two-step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte containing an inhibitor. For an optimum catalyst coverage, superconformal, "bottom-up" filling of trenches and vias is observed. If the catalyst coverage is too low or too high, conformal or subconformal deposition occurs, resulting in void formation during feature filling. The filling behavior of the derivitized electrodes is analogous to that obtained using a single (conventional) electrolyte containing both catalytic and inhibiting species. Restricting the catalyst to the surface by derivitization prior to metal deposition provides strong support for the curvature-enhanced accelerator coverage mechanism of superconformal film growth. From a technical perspective, the two-step process offers an interesting solution to the difficult control issues associated with catalyst destruction and related aging effects known to occur in the "conventional" single-electrolyte superfilling process. © 2002 The Electrochemical Society. All rights reserved. This paper demonstrates superconformal electrodeposition of copper in trenches using a two-step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte containing an inhibitor. For an optimum catalyst coverage, superconformal, "bottom-up" filling of trenches and vias is observed. If the catalyst coverage is too low or too high, conformal or subconformal deposition occurs, resulting in void formation during feature filling. The filling behavior of the derivitized electrodes is analogous to that obtained using a single (conventional) electrolyte containing both catalytic and inhibiting species. Restricting the catalyst to the surface by derivitization prior to metal deposition provides strong support for the curvature-enhanced accelerator coverage mechanism of superconformal film growth. From a technical perspective, the two-step process offers an interesting solution to the difficult control issues associated with catalyst destruction and related aging effects known to occur in the "conventional" single-electrolyte superfilling process. © 2002 The Electrochemical Society. All rights reserved. Export citation and abstract BibTeX RIS
Superconformal Silver Deposition Using KSeCN Derivatized Substrates

B. C. Baker,C. Witt,D. Wheeler,D. Josell,T. P. Moffat

DOI: https://doi.org/10.1149/1.1561280

2003-01-01

Abstract:Superconformal filling of submicrometer trenches was achieved using substrates that were catalyzed with KSeCN prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was dependent on the time the specimen spent in the KSeCN-containing solution prior to electrodeposition. Longer derivatization times correspond to higher initial catalyst coverages. The feature filling results were consistent with the curvature enhanced accelerator coverage mechanism of superconformal deposition. This mechanism implies that area changes during deposition in a feature lead to higher catalyst coverage at the bottom of the feature, thus enhancing the deposition rate and allowing bottom-up fill. © 2003 The Electrochemical Society. All rights reserved. Superconformal filling of submicrometer trenches was achieved using substrates that were catalyzed with KSeCN prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was dependent on the time the specimen spent in the KSeCN-containing solution prior to electrodeposition. Longer derivatization times correspond to higher initial catalyst coverages. The feature filling results were consistent with the curvature enhanced accelerator coverage mechanism of superconformal deposition. This mechanism implies that area changes during deposition in a feature lead to higher catalyst coverage at the bottom of the feature, thus enhancing the deposition rate and allowing bottom-up fill. © 2003 The Electrochemical Society. All rights reserved. Export citation and abstract BibTeX RIS
Underpotential deposition of Cu on Au(111) in sulfate-containing electrolytes: a theoretical and experimental study

Jun Zhang,Yung-Eun Sung,P. A. Rikvold,A. Wieckowski,P.A. Rikvold

DOI: https://doi.org/10.48550/arXiv.cond-mat/9510054

1995-10-11

Condensed Matter

Abstract:We study the underpotential deposition of Cu on single-crystal Au(111) electrodes in sulfate-containing electrolytes by a combination of computational statistical-mechanics based lattice-gas modeling and experiments. The experimental methods are in situ cyclic voltammetry and coulometry and ex situ Auger electron spectroscopy and low-energy electron diffraction. The experimentally obtained voltammetric current and charge densities and adsorbate coverages are compared with the predictions of a two-component lattice-gas model for the coadsorption of Cu and sulfate. This model includes effective, lateral interactions out to fourth-nearest neighbors. Using group-theoretical ground-state calculations and Monte Carlo simulations, we estimate effective electrovalences and lateral adsorbate--adsorbate interactions so as to obtain overall agreement with experiments, including both our own and those of other groups. In agreement with earlier work, we find a mixed R3xR3 phase consisting of 2/3 monolayer Cu and 1/3 monolayer sulfate at intermediate electrode potentials, delimited by phase transitions at both higher and lower potentials. Our approach provides estimates of the effective electrovalences and lateral interaction energies, which cannot yet be calculated by first-principles methods.
Superconformal Electrodeposition of Silver in Submicrometer Features

T. P. Moffat,B. Baker,D. Wheeler,J. E. Bonevich,M. Edelstein,D. R. Kelly,L. Gan,G. R. Stafford,P. J. Chen,W. F. Egelhoff,D. Josell

DOI: https://doi.org/10.1149/1.1490357

IF: 3.9

2002-01-01

Journal of The Electrochemical Society

Abstract:The generality of the curvature-enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from a selenium-catalyzed silver cyanide electrolyte. The CEAC mechanism involves (i) increase of local metal deposition rate with increasing coverage of a catalytic species adsorbed on the metal/electrolyte interface and (ii) significant change of local coverage of catalyst (and thus local deposition rate) in submicrometer features through the changing area of the metal/electrolyte interface. Electrochemical and X-ray photoelectron experiments with planar electrodes (substrates) are used to identify the catalyst and obtain all kinetic parameters required for the simulations of trench filling. In accord with the model, the electrolyte yields optically shiny, dense films, hysteretic current-voltage curves, and rising current-time transients. Experimental silver deposition in trenches from 350 down to 200 nm wide are presented and compared with simulations based on the CEAC mechanism. All kinetics for the modeling of trench filling come from the studies on planar substrates. The results support the CEAC mechanism as a quantitative formalism for exploring morphological evolution during film growth. © 2002 The Electrochemical Society. All rights reserved.

electrochemistry,materials science, coatings & films
Structure and bonding issues at the interface between gold and self-assembled conjugated dithiol monolayers.

Weirong Jiang,Nikolai Zhitenev,Zhenan Bao,Hong Meng,David Abusch-Magder,Don Tennant,Eric Garfunkel

DOI: https://doi.org/10.1021/la0474316

IF: 3.9

2005-01-01

Langmuir

Abstract:Organic thiols have received extensive attention recently because of their relative stability and ease of examination compared to other potential molecular electronic materials. In this work, scanning probe microscopy (SPM) is used to study (i) the structural properties of self-assembled monolayers (SAMs) containing conjugated dithiols and (ii) the formation of the upper molecule-metal interface on dithiol SAMs. The top gold film is deposited either by thermal evaporation or by nano-transfer printing (nTP). Generally, the utility of thermal evaporation is limited because of Au diffusion through the SAMs. However, several dithiol SAMs are identified in this work that bond well to Au overlayers and act as satisfactory diffusion barriers. Coassembly of conjugated dithiols and alkanemonothiols is suggested as a route to obtain dithiols that are denser packed and more vertical (than is obtained from pure dithiol routes). High-yield nTP is demonstrated on coassembled SAMs. Advantages and limitations of different Au deposition and transfer techniques are compared on a variety of length scales.
Coadsorption of Copper and Sulfate on Au(111) Electrodes: Monte Carlo Simulation of a Lattice-Gas Model

J. Zhang,P. A. Rikvold,Y. -E. Sung,A. Wieckowski,P.A. Rikvold,Y.-E. Sung

DOI: https://doi.org/10.48550/arXiv.cond-mat/9503011

1995-03-02

Condensed Matter

Abstract:We report ground-state calculations and Monte Carlo simulations for a lattice-gas model of the underpotential deposition of copper on Au(111) in sulfate-containing electrolytes. In a potential range of approximately 100$\sim$150 mV, this system exhibits a $(\sqrt3\!\times\!\sqrt3)$ mixed phase with 2/3 monolayer (ML) copper and 1/3 ML sulfate. Our simulation results agree well with experimental results and with other theoretical work.
Novel Pd-Catalyzed Electroless Au Deposition Method using a Sulfite Solution

Bing Li,Ning Li,Deyu Li,Yanqing Wang

DOI: https://doi.org/10.1039/c5ra28168g

IF: 4.036

2016-01-01

RSC Advances

Abstract:A novel method is reported for the electroless deposition of Au using nanoscale Pd catalysts in a sulfite solution. The method is simple, stable, and environmentally compatible. The Pd structures provided beneficial reactive properties. In the presence of a Pd layer, the reaction proceeded less through a displacement reaction pathway, and the size of the Au particles produced could be refined.
Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte

Yihua Liu,Lee J Brogan,Matthew A Rigsby,Matthew M Huie,Edward C Opocensky,Tighe A Spurlin,Jon Reid

DOI: https://doi.org/10.1149/1945-7111/ac862d

IF: 3.9

2022-08-04

Journal of The Electrochemical Society

Abstract:Cu electroplating on an ultrathin Co seed has been developed for superconformal filling of advanced interconnects, in an acidic CuSO4 electrolyte containing plating additives, i.e., halide, suppressor, accelerator, and leveler. A suppressor-halide adlayer is found to play a bifunctional role in both suppressing Cu growth and inhibiting Co dissolution. Corrosion inhibition is attributed to adsorption of hydrophobic suppressor molecules on a halide-terminated Co surface that blocks water from interacting with Co, thereby retarding the formation of Co(OH)+, a corrosion immediate with which hydronium from the electrolyte would react to form soluble Co2+. With enhanced suppression, Co loss is mainly confined to the removal of native Co oxides in acid. Correspondingly, galvanic Cu deposition forms a monolayer shortly after immersion at open-circuit potential, becoming self-terminated with growth of a second layer over the next 20 s as dynamic surface processes make more underlying Co available for the displacement reaction. Growth of the first Cu layer is controlled by the receding of native oxides in an exponential-decay manner. Native Co oxides, if not removed, promote Cu protrusions in electroplating. The proposed process produces void-free fill on a 22 nm wide feature with a Co liner about 20 Å thick after fill.

electrochemistry,materials science, coatings & films
Fabrication of Free-Standing Nanoporous Silver by Selectively Dissolving Gold from Gold–silver Alloys Via a Novel Converse Dealloying Method

Ting Chen,Zhaona Liu,Weijie Lu,Xingfeng Zhou,Houyi Ma

DOI: https://doi.org/10.1016/j.elecom.2011.07.001

IF: 5.443

2011-01-01

Electrochemistry Communications

Abstract:A novel converse dealloying method was developed to fabricate free-standing nanoporous silver (np-Ag). One remarkable characteristic of the new dealloying method is that inert component (Au) is selectively removed from Au–Ag alloys while active component (Ag) is left undissolved. Thiourea plays a key role in the formation of a free-standing porous Ag framework since it not only leads to anodic dissolution of Au component but also causes the surface passivation of Ag component. Because of the excellent electrocatalytic activity toward the reduction of trichloroacetic acid (TCA), the as-prepared np-Ag materials can be directly used as working electrodes to detect TCA in the concentration range from 2.50 to 25.0mM.
A Simple Method to Self-Assemble Two-dimensional and Three-dimensional Superlattices of Gold Nanoparticles

Fu Tao,Qin Hai-Yan,Li Wen-Jiang,He Sailing

DOI: https://doi.org/10.1557/proc-1056-hh03-01

2007-01-01

MRS Proceedings

Abstract:Citrate-capped gold nanoparticles with narrow diameter distribution were prepared by the reduction of chloroauric acid with borohydride. After the gold nanoparticles were transferred to toluene solution through ligand conformation change, close-packed two-dimensional nanocrystal lattices were obtained on transmission electron microscopy (TEM) copper grids by evaporating approximately 10 µL of concentrated particle dispersion. The formation of the thiolate gold nanoparticles was investigated by UV-visible absorption spectroscopy and FTIR spectra. The 2D Fourier transform power spectra of the monolayer confirmed the supperlattices’ hexagonal symmetry. Furthermore, long-range-ordered bilayer superlattices, of which the nanoparticles in the top layer piled on the ones in the bottom layer, could also be observed by transmission electron microscopy.
Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition

D. Josell,D. Wheeler,T. P. Moffat

DOI: https://doi.org/10.1149/1.1449304

2002-01-01

Abstract:The curvature enhanced accelerator coverage (CEAC) mechanism recently proposed to explain superconformal filling of fine trenches during copper electrodeposition is shown to also explain superconformal filling and roughness evolution during iodine-catalyzed chemical vapor deposition of copper. As with electrodeposition, the coverage of absorbed catalyst changes with surface area during interface evolution. The surface area decreases along the bottoms of submicrometer features, leading to increased coverage, thus increasing local deposition rates and thereby enabling superconformal filling. This result shows that this CEAC mechanism may be generally applied to understand interface evolution in surfactant mediated film growth processes. © 2002 The Electrochemical Society. All rights reserved. The curvature enhanced accelerator coverage (CEAC) mechanism recently proposed to explain superconformal filling of fine trenches during copper electrodeposition is shown to also explain superconformal filling and roughness evolution during iodine-catalyzed chemical vapor deposition of copper. As with electrodeposition, the coverage of absorbed catalyst changes with surface area during interface evolution. The surface area decreases along the bottoms of submicrometer features, leading to increased coverage, thus increasing local deposition rates and thereby enabling superconformal filling. This result shows that this CEAC mechanism may be generally applied to understand interface evolution in surfactant mediated film growth processes. © 2002 The Electrochemical Society. All rights reserved. Export citation and abstract BibTeX RIS
Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor Deposition of Copper

D. Josell,Sibum Kim,D. Wheeler,T. P. Moffat,Sung Gyu Pyo

DOI: https://doi.org/10.1149/1.1566960

IF: 3.9

2003-01-01

Journal of The Electrochemical Society

Abstract:The mechanism behind superconformal filling of fine features during surfactant catalyzed chemical vapor deposition (CVD) is described and the metrology required to predict it is identified and quantified. The impact of adsorbed iodine coverage on copper deposition rate during chemical vapor deposition of copper on planar substrates is determined first. These kinetic parameters are then used in a model based on the curvature-enhanced accelerator coverage mechanism to predict superconformal filling during iodine-catalyzed CVD. In this model, the coverage of the adsorbed catalyst is presumed to change with surface area during interface evolution. The surface area decreases along the bottoms of submicrometer dimension features, increasing the local coverage and deposition rates and thereby enabling superconformal filling. Experimental filling results are then described and shown to be consistent with the predictions. © 2003 The Electrochemical Society. All rights reserved.

electrochemistry,materials science, coatings & films
Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**

Zhuo Tan,Shuai Liu,Jiedu Wu,Ziang Nan,Fangzu Yang,Dongping Zhan,Jiawei Yan,Bingwei Mao

DOI: https://doi.org/10.1002/celc.202101412

IF: 4

2022-01-20

ChemElectroChem

Abstract:Electrolyte composition can have significant influences on metal deposition. In this work we employ in‐situ scanning tunneling microscope (STM), together with electrochemical methods to investigate Cu deposition on Au (111) in ethaline containing CuCl2. Cyclic voltammograms in the Cu overpotential deposition regime are dominated by a rapidly rising cathodic current, accompanied by a preceding shoulder. Instantaneous nucleation and three‐dimensional growth are discerned for the Cu deposition at larger overpotential. In‐situ STM reveals the shoulder process is associated with the formation of monoatomic‐height clusters. Meanwhile, morphology evolutions of Cu nuclei along with time and potential are followed, and layered hexagonal and hexagon fortress shaped Cu nuclei and their growth are directly observed. Furthermore, atomic‐resolution imaging elucidates an ordered incommensurate (6×√79) adsorption structure on the surface of a Cu nucleus. Our observations are helpful in gaining deeper insights into the effect of deep eutectic solvents (DES) on Cu deposition at microscopic level. Copper deposition on gold electrode in a deep eutectic solvent (DES) containing bivalent Cu(II) are studied by in‐situ scanning tunneling microscope (STM) combined with electrochemical measurements. Initial formation of monoatomic‐height clusters and subsequent morphology evolution of Cu nuclei, as well as an incommensurate (6×√79) adsorption structure are observed, which provide microscopic information for deeper understanding of the role of DES.

electrochemistry
Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology

Thomas P Moffat,Trevor M Braun,David Raciti,Daniel Josell

DOI: https://doi.org/10.1021/acs.accounts.2c00840

2023-05-02

Abstract:ConspectusElectronics manufacturing involves Cu electrodeposition to form 3D circuitry of arbitrary complexity. This ranges from nanometer-wide interconnects between individual transistors to increasingly large multilevel intermediate and global scale on-chip wiring. At larger scale, similar technology is used to form micrometer-sized high aspect ratio through-silicon vias (TSV) that facilitate chip stacking and multilevel printed circuit board (PCB) metallization. Common to all of these applications is void-free Cu filling of lithographically defined trenches and vias. While line-of-sight physical vapor deposition processes cannot accomplish this feat, the combination of surfactants and electrochemical or chemical vapor deposition enables preferential metal deposition within recessed surface features known as superfilling. The same superconformal film growth processes account for the long-reported but poorly understood smoothing and brightening action provided by certain electroplating additives. Prototypical surfactant additives for superconformal Cu deposition from acid-based CuSO4 electrolytes include a combination of halide, polyether suppressor, sulfonate-terminated disulfide, and/or thiol accelerator and possibly a N-bearing cationic leveler. Many competitive and coadsorption dynamics underlie functional operation of the additives. Upon immersion, Cu surfaces are rapidly covered by a saturated halide layer that makes the interface more hydrophobic, thereby supporting the formation of a polyether suppressor layer. Also, halide serves as a cosurfactant supporting the adsorption of amphiphilic molecular disulfide species on the surface while inhibiting copper sulfide formation and incorporation into the growing deposit. Furthermore, the dangling hydrophilic sulfonate end group of the accelerator enables activated metal deposition by hindering polyether suppressor assembly. A common thread in superconformal feature filling is additive-derived positive feedback of the metal deposition reaction within recessed or re-entrant regions. For submicrometer features or optically rough surfaces, area reduction that accompanies the motion of concave surface segments results in the most strongly bound adsorbates' enrichment, which for the suppressor-accelerator systems is the sulfonate-terminated disulfide accelerator species. The superfilling and smoothing process is quantitatively captured by the curvature-enhanced adsorbate coverage mechanism. For larger features, such as TSV, whose depths approach the thickness of the hydrodynamic boundary layer, significant compositional and electrical gradients couple with the metal deposition process to give a negative differential resistance and related nonlinear effects on morphological evolution. For certain suppressor-only electrolytes, remarkable bottom-up feature filling occurs where metal deposition disrupts inhibiting adsorbates at the bottom of the TSV or overruns the ability of the suppressor to form due to kinetic or transport limitations. Because the electrical response to changes in interface chemistry is more rapid than mass transport processes, deposition on planar substrates proceeds by bifurcation into passive and active zones, generating Turing patterns. On patterned substrates, active zone development is biased toward the most recessed regions. The distinction between packaging and on-chip metallization will be blurred as the dimensions of the former merge with those of early day on-chip 3D metallization.
Tunable Sulfur Incorporation into Atomic Layer Deposition Films Using Solution Anion Exchange

Julia D. Lenef,Andrew J. Gayle,Jaesung Jo,Kalyn M. Fuelling,Srinivas K. Yadavalli,Alondra M. Ortiz-Ortiz,Kai Sun,Rebecca L. Peterson,Neil P. Dasgupta

DOI: https://doi.org/10.1021/acs.chemmater.2c03773

IF: 10.508

2023-03-17

Chemistry of Materials

Abstract:Metal sulfide and oxysulfide thin films deposited by atomic layer deposition (ALD) are important functional materials for a range of applications including solar cells, catalysts, and electronic devices. However, ALD of sulfur-containing films typically requires H2S, a toxic, corrosive, and flammable gas. To circumvent these challenges, we propose a method of tuning sulfur incorporation into ALD films by first growing a metal oxide, using CuO x as a model system, followed by a solution-phase sulfur anion-exchange process. By controlling the reaction time, solution molarity, and temperature, we demonstrate tunable sulfur incorporation into the films, which is described using a coupled reaction-diffusion model. The evolution of the film crystallinity, composition, and morphology was quantified as a function of the anion-exchange process parameters. Conformal anion exchange on a ZnO@TiO2@CuO core–shell–shell nanowire is shown, demonstrating the ability to maintain the conformality of the initial ALD process on high-aspect-ratio structures. Additionally, area-selective anion exchange was performed on micro-patterned substrates, illustrating a pathway toward device fabrication. Finally, the electrical properties of the converted films were evaluated, indicating a tunable reduction in sheet resistance of up to 4 orders of magnitude. In the future, the combination of ALD and anion-exchange chemistry can be used to incorporate sulfur without the need for H2S gas, while maintaining the atomically precise and conformal properties of the original ALD process.

materials science, multidisciplinary,chemistry, physical
Superconformal Electrodeposition in Vias

D. Josell,D. Wheeler,T. P. Moffat

DOI: https://doi.org/10.1149/1.1452485

2002-01-01

Abstract:Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal filling of vias is predicted to occur over a more limited range of electrodeposition conditions than in trenches of similar aspect ratio with significant implications for dual damascene processing. Parameters for the model describing both the accumulation of accelerator on the copper/electrolyte interface and the impact of the accumulated accelerator on the local deposition rate come from voltammetry experiments on planar electrodes. An idealized geometry permits reduction of the 3D filling problem to solution of a system of coupled first-order, nonlinear ordinary differential equations. © 2002 The Electrochemical Society. All rights reserved. Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal filling of vias is predicted to occur over a more limited range of electrodeposition conditions than in trenches of similar aspect ratio with significant implications for dual damascene processing. Parameters for the model describing both the accumulation of accelerator on the copper/electrolyte interface and the impact of the accumulated accelerator on the local deposition rate come from voltammetry experiments on planar electrodes. An idealized geometry permits reduction of the 3D filling problem to solution of a system of coupled first-order, nonlinear ordinary differential equations. © 2002 The Electrochemical Society. All rights reserved. Export citation and abstract BibTeX RIS
Electrodeposition of Sb on Au(111) from an Acidic Chloroaluminate Ionic Liquid: an in Situ STM Study

Feng-Xia Wang,Ge-Bo Pan,Ying-Dan Liu,Yan Xiao

DOI: https://doi.org/10.1021/jp910973c

2010-01-01

The Journal of Physical Chemistry C

Abstract:The electrodeposition of Sb on Au(111) in an acidic chloroaluminate ionic liquid has been investigated by cyclic voltammetry and scanning tunneling microscopy (STM). In Situ STM imaging has revealed ail ordered Structure of the adsorbed SbCl2+ at 1.1 V vs Al/Al(III), which has further compressed into a Moire-like pattern at 1.05 V. In the UPD range of Sb, a sudden smoothing of surface has been observed at 1.0 V, which is similar to those in BMIBF4. In the later stage, the nucleation process begins to Occur and is followed by the formation of 2D-nanostripe architectures. Instead of width, the number and the length of Sb nanostripes increase with time. When the potential goes more negative, Clusters are formed oil the top of close-packed Sb nanostripes. These results are different from the Sb UPD in the neutral melt, implying that the acidicity of ionic liquid might play ail Important role in the deposition of Sb.
Deposition of Au[sub x]Ag[sub 1−x]/Au[sub y]Ag[sub 1−y] Multilayers and Multisegment Nanowires

Chunxin Ji,Gerko Oskam,Yi Ding,Jonah D. Erlebacher,Anthony J. Wagner,Peter C. Searson

DOI: https://doi.org/10.1149/1.1585053

IF: 3.9

2003-01-01

Journal of The Electrochemical Society

Abstract:AuxAg1-x/AuyAg1-y multilayers and multisegment nanowires were deposited from a single solution containing KAu(CN)(2), KAg(CN)(2), and Na2CO3 (pH 13). Cyclic voltammograms for deposition from solutions containing Au(CN)(2)(-) and Ag(CN)(2)(-) show the characteristic deposition peaks for gold and silver. The composition of the deposited alloys is dependent on the deposition potential (or current) and solution chemistry. Multisegment nanowires were prepared by sequential deposition at -0.7 and -1.2 V from solutions containing Au(CN)(2)(-) and Ag(CN)(2)(-) solution in porous Al2O3 templates. The different segments deposited at -0.7 and -1.2 V are clearly distinguished by scanning electron microscopy and optical microscopy under blue light illumination. (C) 2003 The Electrochemical Society.
Sulfite Ion and Gold (111) Surface Interaction Mechanism

Yasin Zia,Kourosh Rahimi,Mehrdad Najafi Liavali,Amir Bayat,Esmaiel Saievar Iranizad

DOI: https://doi.org/10.1016/j.physb.2024.416064

IF: 2.988

2024-05-06

Physica B Condensed Matter

Abstract:The interaction of a sulfite ion (SO 3 2- ) with the Au (111) surface has been studied using density functional theory. The results of the geometry optimization, the charge density distribution, and the density of states showed that sulfite ions exhibit a strong interaction with the Au (111) surface atoms, and they are adsorbed by forming a strong ionic bond that leads to the rearrangement of Au surface atoms. Consequently, this interaction leads to a charge transfer from the sulfite ion to Au surface atoms. The results proved a change in the geometry of the adsorbed sulfite ion, but it is not degraded on the gold surface because of the covalent bonds between sulfur and oxygen atoms.

physics, condensed matter
Simulated Dynamics of Underpotential Deposition of Cu with Sulfate on Au(111)

Gregory Brown,Per Arne Rikvold,M. A. Novotny,Andrzej Wieckowski

DOI: https://doi.org/10.48550/arXiv.cond-mat/9709320

1998-05-05

Abstract:Numerical studies of lattice-gas models are well suited to describe multi-adsorbate systems. One example is the underpotential deposition of Cu on Au(111) in the presence of sulfuric acid. Preliminary results from dynamic Monte Carlo simulations of the evolution of the adsorbed layer during potential-step experiments across phase transitions are presented for this particular system. The simulated current profiles reproduce a strong asymmetry seen in recent experiments. Examination of the microscopic structures that occur during the simulated evolution processes raises questions that need to be investigated by further experimental and theoretical study.

Statistical Mechanics,Chemical Physics

Superconformal Deposition of Au in a Sulfite Electrolyte

Superconformal Electrodeposition Using Derivitized Substrates

Superconformal Silver Deposition Using KSeCN Derivatized Substrates

Underpotential deposition of Cu on Au(111) in sulfate-containing electrolytes: a theoretical and experimental study

Superconformal Electrodeposition of Silver in Submicrometer Features

Structure and bonding issues at the interface between gold and self-assembled conjugated dithiol monolayers.

Coadsorption of Copper and Sulfate on Au(111) Electrodes: Monte Carlo Simulation of a Lattice-Gas Model

Novel Pd-Catalyzed Electroless Au Deposition Method using a Sulfite Solution

Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte

Fabrication of Free-Standing Nanoporous Silver by Selectively Dissolving Gold from Gold–silver Alloys Via a Novel Converse Dealloying Method

A Simple Method to Self-Assemble Two-dimensional and Three-dimensional Superlattices of Gold Nanoparticles

Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor Deposition of Copper

Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**

Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology

Tunable Sulfur Incorporation into Atomic Layer Deposition Films Using Solution Anion Exchange

Superconformal Electrodeposition in Vias

Electrodeposition of Sb on Au(111) from an Acidic Chloroaluminate Ionic Liquid: an in Situ STM Study

Deposition of Au[sub x]Ag[sub 1−x]/Au[sub y]Ag[sub 1−y] Multilayers and Multisegment Nanowires

Sulfite Ion and Gold (111) Surface Interaction Mechanism

Simulated Dynamics of Underpotential Deposition of Cu with Sulfate on Au(111)