Flexible Temperature‐Invariant Polymer Dielectrics with Large Bandgap

Chao Wu,Ajinkya A. Deshmukh,Zongze Li,Lihua Chen,Abdullah Alamri,Yifei Wang,Rampi Ramprasad,Gregory A. Sotzing,Yang Cao

DOI: https://doi.org/10.1002/adma.202000499

IF: 29.4

2020-04-06

Advanced Materials

Abstract:<p>Flexible dielectrics operable under simultaneous electric and thermal extremes are critical to advanced electronics for ultrahigh densities and/or harsh conditions. However, conventional high‐performance polymer dielectrics generally have conjugated aromatic backbones, leading to limited bandgaps and hence high conduction loss and poor energy densities, especially at elevated temperatures. A polyoxafluoronorbornene is reported, which has a key design feature in that it is a polyolefin consisting of repeating units of fairly rigid fused bicyclic structures and alkenes separated by freely rotating single bonds, endowing it with a large bandgap of ≈5 eV and flexibility, while being temperature‐invariantly stable over −160 to 160 °C. At 150 °C, the polyoxafluoronorbornene exhibits an electrical conductivity two orders of magnitude lower than the best commercial high‐temperature polymers, and features an unprecedented discharged energy density of 5.7 J cm⁻³ far outperforming the best reported flexible dielectrics. The design strategy uncovered in this work reveals a hitherto unexplored space for the design of scalable and efficient polymer dielectrics for electrical power and electronic systems under concurrent harsh electrical and thermal conditions.</p>

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology