Reduction of Escherichia coli adhesion to AISI 316L stainless steel surface by using mechanical and electrochemical polishing processes

Tuangthong Chotchutiphong,Viboon Tangwarodomnukun
DOI: https://doi.org/10.1080/00218464.2020.1785295
2020-06-24
The Journal of Adhesion
Abstract:This paper presents the role of surface roughness on the bacterial adhesion to the food-grade AISI 316L stainless steel surface, which was prepared by the mechanical and electrochemical polishing processes. <i>Escherichia coli</i> or <i>E. coli</i> was the bacteria tested in this study as it is a sanitization indicator in the food and pharmaceutical industries. The average surface roughness (<i>R<sub>a</sub> </i>), peak-to-valley roughness (<i>R<sub>y</sub> </i>), and five-point average roughness (<i>R<sub>z</sub> </i>) of the polished surface were measured, and the results demonstrated that the amount of <i>E. coli</i> was found to increase with the increased surface roughness. As per the electrochemical polishing process, the effects of applied voltage, electrolyte concentration, and polishing time on the three roughness parameters were examined. Besides the <i>R<sub>a</sub> </i>, the influence of <i>R<sub>y</sub> </i> and <i>R<sub>z</sub> </i> on the bacterial adhesion was found to be very significant. By using the electrochemical process with a suitable polishing condition, the <i>R<sub>y</sub> </i> and <i>R<sub>z</sub> </i> were substantially reduced compared to the mechanically polished surface with the similar level of <i>R<sub>a</sub> </i>. The amount of bacteria on the electrochemically polished surface was also lower than the mechanical one by 25% on average.
materials science, multidisciplinary,engineering, chemical,mechanics
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