Abstract:A high-field asymmetric ion mobility spectrometry (FAIMS) chip based on printed circuit board (PCB) brazing has been fabricated. A needle-to-ring structure was used as the ion source. The ring electrode was formed by punching a 3 mm hole on the PCB and covering it with copper. The FAIMS chip was composed of two PCB boards connected by brazing. The peak value of a FAIMS spectrum was increased by reducing the ballast resistance and increasing the discharge voltage and gas velocity. When ethanol was used as the analyte, the limit of detection (LOD) is approximately 0.06 mg/L.

Printed Circuit Board (PCB) Brazing and Ion Source Integration of a High-Field Asymmetric Ion Mobility Spectrometry (FAIMS) Chip