Abstract:Over the past few decades, electronics have become commonplace in government, commercial, and social domains. These devices have developed rapidly, as seen in the prevalent use of system-on-chips rather than separate integrated circuits on a single circuit board. As the semiconductor community begins conversations over the end of Moore’s law, an approach to further increase both functionality per area and yield using segregated functionality dies on a common interposer die, labeled a System in Package (SiP), is gaining attention. Thus, the chiplet and SiP space has grown to meet this demand, creating a new packaging paradigm, advanced packaging, and a new supply chain. This new distributed supply chain with multiple chiplet developers and foundries has augmented counterfeit vulnerabilities. Chiplets are currently available on an open market, and their origin and authenticity consequently are difficult to ascertain. With this lack of control over the stages of the supply chain, counterfeit threats manifest at the chiplet, interposer, and SiP levels. In this article, we identify counterfeit threats in the SiP domain, and we propose a mitigating framework utilizing blockchain for the effective traceability of SiPs to establish provenance. Our framework utilizes the Chiplet Hardware Security Module to authenticate a SiP throughout its life. To accomplish this, we leverage SiP information including electronic chip identification of chiplets, combating die and IC recycling sensor information, documentation, test patterns and/or electrical measurements, grade, and part number of the SiP. We detail the structure of the blockchain and establish protocols for both enrolling trusted information into the blockchain network and authenticating the SiP. Our framework mitigates SiP counterfeit threats including recycled, remarked, cloned, overproduced interposer, forged documentation, and substituted chiplet while detecting of out-of-spec and defective SiPs.

Split-Chip Design to Prevent IP Reverse Engineering

Efficient and secure intellectual property (IP) design with split fabrication

Protect Your Chip Design Intellectual Property: An Overview

A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

Security Assessment of Interposer-based Chiplet Integration

Circuit Partitioning Based Fingerprinting Method for IP Protection

An Interposer-Based Root of Trust: Seize the Opportunity for Secure System-Level Integration of Untrusted Chiplets

A Look at the Dark Side of Hardware Reverse Engineering -- A Case Study

Verification of physical designs using an integrated reverse engineering flow for nanoscale technologies

Best of Both Worlds: Integration of Split Manufacturing and Camouflaging into a Security-Driven CAD Flow for 3D ICs

Enabling High-Performance Heterogeneous Integration via Interface Standards, IP Reuse, and Modular Design

2.5D Root of Trust: Secure System-Level Integration of Untrusted Chiplets

A Survey on Split Manufacturing: Attacks, Defenses, and Challenges

Exploring Advanced Packaging Technologies for Reverse Engineering a System-in-Package (SiP)

Raise Your Game for Split Manufacturing: Restoring the True Functionality Through BEOL

Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration

DECOY: DEflection-Driven HLS-Based Computation Partitioning for Obfuscating Intellectual PropertY

Design for Assurance: Employing Functional Verification Tools for Thwarting Hardware Trojan Threat in 3PIPs

Heterogeneous Integration Supply Chain Integrity Through Blockchain and CHSM

A Survey on Chip to System Reverse Engineering

Propelling Innovation to Defeat Data-Leakage Hardware Trojans: From Theory to Practice