Low thermal conductivity in a modular inorganic material with bonding anisotropy and mismatch

Quinn D Gibson,Tianqi Zhao,Luke M Daniels,Helen C Walker,Ramzy Daou,Sylvie Hébert,Marco Zanella,Matthew S Dyer,John B Claridge,Ben Slater,Michael W Gaultois,Furio Corà,Jonathan Alaria,Matthew J Rosseinsky,Quinn D. Gibson,Luke M. Daniels,Helen C. Walker,Matthew S. Dyer,John B. Claridge,Michael W. Gaultois,Matthew J. Rosseinsky
DOI: https://doi.org/10.1126/science.abh1619
IF: 56.9
2021-08-27
Science
Abstract:Blocking heat in two ways Low thermal conductivity is important for barrier coatings, thermoelectrics, and other applications. Gibson et al . combined two complementary methods that manipulate internal interface properties to dramatically decrease the thermal conductivity of the inorganic material BiO 2 Cl 2 Se (see the Perspective by Kim and Cahill). The authors took advantage of both in-plane structural distortions and weak bonding layers to push the conductivity down to 0.1 watts per kelvin per meter: only four times that of air. The principles should be applicable to other systems and provide a method for developing crystals with extremely low thermal conductivity. —BG
multidisciplinary sciences
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