Cure kinetics and conductivity of rigid rod epoxy with polyaniline as a curing agent

Tiezhu Fu,Jia Liu,Jing Wang,Hui Na
DOI: https://doi.org/10.1002/pc.20703
IF: 5.2
2009-10-01
Polymer Composites
Abstract:The samples of rigid rod epoxy resin (4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP)) with different weight contents of polyaniline (PANI) as a curing agent were prepared. The kinetics of curing reaction between TMBP and PANI was analyzed by dynamic differential scanning calorimetry in the temperature range of 25–300°C. The results showed that the heat of cure reaction of TMBP/PANI sample with 10 wt% PANI was larger than those of others. The active energies with different curing conversions of TMBP/PANI sample with 10 wt% PANI were calculated by iso‐conversional method using the Coats‐Redfern approximation. The results showed that the activation energy was dependent on the degree of conversion. The morphology of the cured samples was detected by scanning electron microscopy measurements. The relationship between morphology and conductivity of cured samples was researched. The conductivities increased from 2.7 × 10−4 to 9.5 × 10−4 S/cm with the increase of PANI from 5 to 20 wt% in cured samples. The thermal stabilities of cured TMBP/PANI samples were examined by thermogravimetric analysis. The results showed that the cured TMBP/PANI can be promising to use as a conducting adhesive. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers
materials science, composites,polymer science
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