Effect of submicron pore sized waste coffee emesis biochar on glass–epoxy composite thermal interface material
B. Venkatesh,G. Gandhimathi,N. Nagabhooshanam,Gadde Raghu Babu,Dhanesh Babu S D,Karedla Lakshmi Kishore,Kota Marathi Vijay,Manzoore Elahi M. Soudagar
DOI: https://doi.org/10.1007/s13399-024-05558-6
IF: 4.05
2024-04-14
Biomass Conversion and Biorefinery
Abstract:This study focusing on the mechanical, thermal conductivity, and dielectric properties of novel epoxy-based composite contains submicron pore sized waste coffee emesis biochar (SCB) and glass fiber. In this study, a novel submicron pore sized (~ 0.5 μm) coffee emesis biochar was repared from the waste coffee grounds, which is the usual by-product in coffee processing and dispersed with glass fiber to make high dielectric constant and low thermal conductive composites for thermal interface applications. Various mechanical tests, including tensile strength, flexural strength, impact resistance, and shore-D hardness, were conducted following ASTM standards to ascertain the load-bearing properties of prepared composites. The findings indicate that the incorporation of SCB significantly improved the tensile and flexural strength up to 158 MPa and 211 MPa, respectively, and exhibits impact energy of 6.82 J, rendering these composites suitable for impact-prone applications. Furthermore, thermal conductivity measurements revealed a linear increase with rising biochar content, with EGC3 (resin of 67 wt.%, glass fiber of 30 wt.%, and 3 wt.% of biochar) displaying a higher thermal conductivity of 0.462 W/mK. Moreover, analysis of dielectric behavior shows that it varies with the concentration of biochar, with EGC3 displaying a dielectric constant of 4.51 and a dielectric loss of 0.649. These composites offer a unique combination of enhanced mechanical strength, improved thermal conductivity, and adjustable dielectric behavior to suit as a thermal interface material for various electronics applications.
energy & fuels,engineering, chemical