Measuring Microscale In-Plane Indentation Displacement Field for Material Characterization
Giyeol Han,Bohyeon Lee,Joao Henrique Fonseca,Hyungyil Lee,João Henrique Fonseca
DOI: https://doi.org/10.1109/tim.2024.3366585
IF: 5.6
2024-03-02
IEEE Transactions on Instrumentation and Measurement
Abstract:A method measuring microscale in-plane indentation displacement field on the indented specimen surface is proposed by utilizing an optical flow (OF) algorithm. With images taken before and after indentation test, the calculated displacement field containing noise ( ) is computed using the OF algorithm. Due to the microvibration and the repositioning error after indentation test, the originally calculated contains the displacement error . Thus, is corrected using the origin-symmetric condition of indentation displacement field formed by the axisymmetric indenter. The effect of the grain size and the surface roughness of specimen on the field are also investigated. The corrected fields from the indentation tests for various materials (steel, copper, and aluminum) are verified by comparing to the indentation finite element analysis (FEA). After correcting the error , the average correlation coefficient between the displacement curve from the OF and the indentation FEA is 99% for all materials. Finally, it is concluded that the proposed method can measure the accurate in-plane indentation displacement field on a microscale.
engineering, electrical & electronic,instruments & instrumentation