Advanced Functional Composite Materials toward E‐Skin for Health Monitoring and Artificial Intelligence

Qi‐Jun Sun,Qin‐Teng Lai,Zhenhua Tang,Xin‐Gui Tang,Xin‐Hua Zhao,Vellaisamy A. L. Roy
DOI: https://doi.org/10.1002/admt.202201088
IF: 6.8
2022-11-01
Advanced Materials Technologies
Abstract:Functional polymer composite (FPC) material based E‐skin shows superiorities in light‐weight, high sensitivity, excellent flexibility, and stretchability. With the excellent properties, FPC‐based E‐skin shows great potential applications in health monitoring and artificial intelligence, including wrist pulse monitoring, body temperature monitoring, human motion detection, prosthetics, and robotics as well. Electronic skin (E‐skin), especially the wearable sensors efficiently detect various stimuli attracted huge research interest owing to their potential applications in health monitoring and artificial intelligence. On the other hand, functional polymer composites possessing excellent properties such as light weight, good flexibility, and superior electrical performances, are promising candidates as building blocks for flexible electronics. Accordingly, tremendous efforts are devoted to the development of polymer composites with functional properties for E‐skin applications. Here, recent advances on the controlled fabrication of various fillers based functional polymer composites and their diverse applications in E‐skin are reviewed. In addition, contemporary studies on fabrication strategies, working mechanisms, and device performance for E‐skin based on the functional polymer composites are reviewed, including flexible pressure sensors, strain sensors, temperature sensors, energy harvesters, and transistors. Furthermore, the applications of functional composite based flexible electronics in healthcare and artificial intelligence are discussed. Finally, the existing challenges and opportunities for the functional composite materials based E‐skin are summarized.
materials science, multidisciplinary
What problem does this paper attempt to address?