Abstract:Copper (Cu) removal from chemical mechanical polishing (CMP) waste is critical to maintaining discharge compliance with local municipalities and the Environmental Protection Agency (EPA). Typical treatment of this waste stream has followed two conventions: either coagulant-based precipitation or ion exchange (IX). 1 Many industries use iron-based coagulants for metal removal from wastewater to meet discharge compliance. However, the process is often cumbersome, requires long settling times and significant chemical utilization, and results in a sludge stream that must be shipped and disposed of properly, eliminating the possibility for metal recovery. Since the concentrations for Cu removal from CMP waste streams is normally low (<100 ppm), IX has generally been the preferred treatment method. Nevertheless, IX also has some negatives associated with the process. Hydrogen peroxide can and will damage the IX media, resulting in premature replacement. The industry has dealt with this impact by employing one-time use media, but this adjustment means that media is only used once before being shipped offsite for regeneration. This results in operational impacts due to the need for oversight of media replacement and also eliminates the ability for Cu to be recovered at the originating process site. In this talk, electrochemical methods to recover Cu from CMP wastewaters will be described. Electrochemical cell design and operation will be shown to provide Cu removal across wide ranges of concentration, and the depth of Cu separation (<2 ppm) and efficiency of the process will be discussed. The presence of hydrogen peroxide and its influence on the process will be evaluated. The removal and recovery of Cu will be shown in a complete cycle, demonstrating the ability to recover and reuse Cu directly at a process site. The impact of (1) pH, (2) chelator type, and (3) abrasive (SiO 2 ) will also all be reviewed. Changes to the slurry, as analyzed pre- and post-electrochemical separation, will be characterized to determine possibilities for the reuse of the CMP slurry itself. Ultimately, the ability to design process systems using electrical input and minimal chemical additives to treat wastewater to municipal and EPA specifications while maximizing recycling efforts will be evaluated and presented. References: E. Speed, Environmental Aspects of Planarization Processes, S. Babu (Ed.), Advances in Chemical Mechanical Planarization (CMP) , Woodhead Publishing, 229-269 (2016). Figure 1

An Ellipsometric Study of Surface Films on Copper Electrodes Undergoing Electropolishing

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Surface Plasmon Resonance Coupled with Potential‐step Chronoamperometry: Theory and Applications for Quantitative Measurements of Electrodeposited Thin Films

Electropolishing of single crystal and polycrystalline aluminum to achieve high optical and mechanical surfaces

Electrochemical deposition and stripping of copper, nickel and copper nickel alloy thin films at a polycrystalline gold surface: a combined voltammetry-coulometry-electrochemical quartz crystal microgravimetry study

In-situ Evidence for the Existence of Surface Films in Electrochemical Machining of Copper in Nitrate Electrolytes

An SERS study of the galvanostatic sequence employed for the electrochemical deposition of Copper in the fabrication of Interconnects

Comparison of Electropolishing of Aluminum in a Deep Eutectic Medium and Acidic Electrolyte

Fabrication of Smooth, Periodic Surface Structures: Combining Direct Laser Interference Patterning and Electropolishing

Effect of Electropolishing of Metals and Alloys in a Deep Eutectic Solvent on Their Corrosion Characteristics

Electrochemical Investigation of Dynamic Interfacial Processes at 1-Octadecanethiol-modified Copper Electrodes in Halide-Containing Solutions

Material Removal and Surface Modification of Copper under Ultrasonic-Assisted Electrochemical Polishing

Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin

Morphology Behavior of Copper Films Deposited after Wet Surface Treatment on Polished Alumina

Electropolishing—A Practical Method for Accessing Voids in Metal Films for Analyses

Effect of methanolic plant extract on copper electro-polishing in ortho-phosphoric acid

Investigation of the Behaviors of Various Electroplated Copper Films During CMP

In situ X-ray nanotomography of metal surfaces during electropolishing

Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion

Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents

Electrochemical Cell Design and Operation for Copper Recovery from Chemical Mechanical Polishing Slurries