Leaching of copper from waste printed circuit boards using Phanerochaete chrysosporium fungi

Qian Liu,Jian-feng Bai,Wei-hua Gu,Sheng-juan Peng,Lin-cai Wang,Jing-wei Wang,Hui-xin Li
DOI: https://doi.org/10.1016/j.hydromet.2020.105427
IF: 4.217
2020-09-01
Hydrometallurgy
Abstract:<p>We investigated the leaching of copper with <em>Phanerochaete chrysosporium</em> (<em>P. chrysosporium</em>) from waste printed circuit boards (WPCBs). Leaching of copper after treatment with <em>P. chrysosporium</em> for 14 days was 60.96%, which was 9 times higher than that in absence of the fungi. After 14 days of treatment with fungi, the copper clad laminates of printed circuit boards were seriously corroded without any metallic luster with the corresponding color change from yellow to reddish-brown. An oxidation layer was formed on the surface of the copper clad laminate. It consisted of copper, cupric oxide (CuO), cuprous oxide (Cu<sub>2</sub>O), and mycelia. The leaching of copper by <em>P. chrysosporium</em> is a result of the combined effect of the bio-enzymes and organic acids. Bio-enzymes, such as laccase (Lac), manganese peroxidase (MnP), and lignin peroxidase (LiP), attacked the chemical bonds in the copper crystal using the generated free radicals. Organic acids, such as oxalic acid, gluconic acid, and citric acid, leached copper because of the H<sup>+</sup> ions produced due to acidolysis. In addition, the organic acids also influenced the leaching of copper indirectly by changing the pH of the leaching system.</p>
metallurgy & metallurgical engineering
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