Halogen-induced planar defects in Cu catalysts for ammonia electrosynthesis at an ampere-level current density

Yan Wang,Shuai Xia,Jianfang Zhang,Ashok Kumar Ummireddi,Zhengyuan Li,Xu Yuan,Cuiping Yu,Yong Zhang,Jingjie Wu,Yucheng Wu
DOI: https://doi.org/10.1039/d3qm00114h
IF: 8.6834
2023-04-22
Materials Chemistry Frontiers
Abstract:The electrocatalytic nitrate reduction reaction (NO3-RR) provides an effective route for removing NO3- from wastewater and converting it to valuable ammonia (NH3). Here, we describe the halogen-incorporated Cu (Cu-X) catalysts derived from the in-situ reduction of CuO nanoparticles in electrocatalytic NO3-RR. Electrochemical reconstruction induces various defect active sites in Cu-X catalysts by doping different halogens. The coexisted planar twin boundary (TB) and stacking fault (SF) defects in the Cu-F electrode possess higher activity than sole SF defects in Cu-Cl and grain boundary (GB) defects in both Cu-Br and Cu-I electrodes. The electrochemical in-situ spectroscopic analysis reveals that the simultaneous TB and SF defects in the Cu-F electrode enhance the adsorption capacity of reaction intermediates and improve the conversion efficiency of NO3- to NH3. An ampere-level current density of NH3 synthesis is achieved on the Cu-F electrode with a high yield rate of 5.22 mmol h-1 cm-2 Faradaic efficiency of 96.2%, and stability over 24 h. This work provides a promising strategy to finely modulate active sites in the Cu catalyst for high-efficiency NH3 synthesis from NO3-RR .
materials science, multidisciplinary,chemistry
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