Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules

M.W. Beranek,E.Y. Chan,Chiu-Chao Chen,K.W. Davido,H.E. Hager,Chi-Shain Hong,D.G. Koshinz,M. Rassaian,H.P. Soares,R.L. St. Pierre,P.j. Anthony,M.A. Cappuzzo,J.V. Gates,L.T. Gomez,G.E. Henein,J. Shmulovich,M.A. Occhionero,K.P. Fennessy

DOI: https://doi.org/10.1109/6040.861561

2000-01-01

IEEE Transactions on Advanced Packaging

Abstract:Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC) ruggedized for military/aerospace avionics fiber-optic transmitter and receiver applications have been developed, LED-PAC and PIN-PAC silicon micro-optical bench substrates were fabricated together on a 5 in diameter silicon wafer via multistage photolithography, thin-film, and substrate processing. Alignment v-grooves designed for passive optical alignment of 100/140 /spl mu/m multimode optical fiber to the optoelectronic devices were terminated by solder locking the fiber to the silicon PAC substrates. The LED-PAC comprising a surface emitting LED die-bonded onto a novel precision molded AM submount passively mounted onto the silicon microbench achieves the required high coupling efficiency to 100/140 /spl mu/m multimode optical fiber to meet stringent avionics transmitter output power requirements. The 100/130 /spl mu/m multimode optical fiber-pigtailed PIN-PAC with a refractive lens etched into the p-i-n photodiode backside surface exhibited responsivities greater than 0.8 A/W at 1.3 /spl mu/m wavelength. The LED-PAC and PIN-PAC optical subassemblies integrated with Boeing ARINC 636 (FDDI) transmitter and receiver thick film multichip (MCM-C) circuitry are capable of meeting both ARINC 636 and FDDI physical layer requirements.