Abstract:Cerebral organoids are hSPC derived tissue complexes that self-organize over an extended period and begin to recapitulate certain features of in vivo neurogenesis, and there is a need to develop tools that allow for the physical and electrical interrogation of these cell complexes as they mature. Presented here is a method of manufacturing thin, porous, scalable silicon scaffolds as a structure to support multi-electrode arrays using industry standard semiconductor fabrication techniques. Mechanical tests by nanoindentation demonstrate the scaffold as linearly elastic with an approximated effective stiffness of 51.6 MPa. Biological cell studies indicate that mature Cerebral Organoids are capable of cellular expansion through, and partially absorbing, the scaffold, with 0.125 mm3 ± 0.027 of new tissue generation over a 5-day culture period. The structure is designed for compatibility with front end of line and back end of line semiconductor processes for future integration with metal electrodes, which enables deep tissue access in multi-cellular structures.

Si/SiO2 silicon-on-insulator based scaffold for interfacing with cerebral organoids