Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader

Qingwei Yan,Wen Dai,Jingyao Gao,Xue Tan,Le Lv,Junfeng Ying,Xiaoxin Lu,Jibao Lu,Yagang Yao,Qiuping Wei,Rong Sun,Jinhong Yu,Nan Jiang,Ding Chen,Ching-Ping Wong,Rong Xiang,Shigeo Maruyama,Cheng-Te Lin
DOI: https://doi.org/10.1021/acsnano.0c09229
IF: 17.1
2021-03-18
ACS Nano
Abstract:The rapid development of integrated circuits and electronic devices creates a strong demand for highly thermally conductive yet electrically insulating composites to efficiently solve "hot spot" problems during device operation. On the basis of these considerations, hexagonal boron nitride nanosheets (BNNS) have been regarded as promising fillers to fabricate polymer matrix composites. However, so far an efficient approach to prepare ultrahigh-aspect-ratio BNNS with large lateral size while maintaining an atomically thin nature is still lacking, seriously restricting further improvement of the thermal conductivity for BNNS/polymer composites. Here, a rapid and high-yield method based on a microfluidization technique is developed to obtain exfoliated BNNS with a record high aspect ratio of ≈1500 and a low degree of defects. A foldable and electrically insulating film made of such a BNNS and poly(vinyl alcohol) (PVA) matrix through filtration exhibits an in-plane thermal conductivity of 67.6 W m<sup>–1</sup> K<sup>–1</sup> at a BNNS loading of 83 wt %, leading to a record high value of thermal conductivity enhancement (≈35 500). The composite film then acts as a heat spreader for heat dissipation of high-power LED modules and shows superior cooling efficiency compared to commercial flexible copper clad laminate. Our findings provide a practical route to produce electrically insulating polymer composites with high thermal conductivity for thermal management applications in modern electronic devices.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsnano.0c09229?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsnano.0c09229</a>.Theoretical analysis of the effect of the aspect ratio of BNNS on the heat transfer capability of the composites based on Foygel's nonlinear model; mechanism of the exfoliation during microfluidization and the shear rate calculation in the process; shear rate calculation in the microfluidization process; tables and figures that support the text (<a class="ext-link" href="/doi/suppl/10.1021/acsnano.0c09229/suppl_file/nn0c09229_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
What problem does this paper attempt to address?
The paper attempts to address the critical material requirements for efficient heat dissipation in electronic devices. With the rapid development of integrated circuits and electronic devices, solving the "hotspot" issue during device operation has become particularly important. To achieve this, it is necessary to develop composite materials with high thermal conductivity and electrical insulation. Hexagonal boron nitride nanosheets (BNNS) are considered ideal fillers for manufacturing such polymer-based composites. However, there is currently a lack of an effective method to prepare ultra-high aspect ratio BNNS with large lateral dimensions while maintaining atomic layer thickness, which severely limits the further enhancement of the thermal conductivity of BNNS/polymer composites. The main objective of the paper is to develop a rapid, high-yield method through microfluidization technology to obtain exfoliated BNNS with an aspect ratio of approximately 1500 and low defect levels. The BNNS prepared using this method, combined with a polyvinyl alcohol (PVA) matrix, forms composite films through filtration. When the BNNS loading is 83 wt%, the in-plane thermal conductivity reaches 67.6 W m^-1K^-1, with a thermal conductivity enhancement value of approximately 35500. These composite films, used as flexible, electrically insulating heat sinks for high-power LED modules, demonstrate better cooling efficiency than commercial flexible copper-clad laminates (FCCL). The research results provide a practical approach for producing high thermal conductivity, electrically insulating polymer composites for thermal management applications in modern electronic devices.