Abstract:The Cu materials are playing an irreplaceable role in modern marine facilities, while one major issue affecting their service life is corrosion attack caused by external erosion of chloride ions, which leads to the quickly structural deterioration and reduced durability. To solve this obstinate issue, the corrosion−resistant Ni−based composite films with conductive Yttria–stabilized zirconia (YSZ, 2.5–15 g/L) and non−conductive Si 3 N 4 (2.5–15 g/L) reinforcing phases were composite–electrodeposited on Cu substrate in direct current (DC) mode. It was believed that the electrical differences of incorporated nanoparticles have a significant impact on nucleation and growth behaviors during electrodeposition, which further altered the structure and property of Ni−based composite films. Therefore, the emphasis of this study was to establish the correlation between obtained structure, electrochemical, and immersion corrosion performances at different incorporation levels of YSZ/Si 3 N 4 nanoparticles. The results demonstrate that by increasing the total doping contents, the Electrochemical Impedance Spectroscopy (EIS) and Chronoamperometry (CA) measurements exhibited an initial increase followed by a subsequent decrease on co−deposition dynamics, which was related to the dominant impact of conductive YSZ nanoparticle at electrocrystallization process. Meanwhile, the moderate incorporation level of 15 g/L offered effective control over structural compactness through dispersion−strengthening and grain−refining, and the same ratio of YSZ/Si 3 N 4 nanoparticles further maximized the improvement degree of microhardness, electrochemical passivation, and immersion stability of resulting films. Besides, the corrosion current density ( j corr ) of Ni−YSZ−Si 3 N 4 composite coating under optimum condition of 15 g/L was two orders of magnitude smaller than that of Cu substrate after long−term immersion test, and the corresponding polarization resistance ( R p ) also increased by 8.6 times. Overall, these substantial alterations obtained provide effective guideline for the design and preparation of corrosion−resistant Ni−based composite coating, which is beneficial to prolonging the service life of Cu components in saline environments.

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Decomplexation removal of Ni(II)-citrate complexes through heterogeneous Fenton-like process using novel CuO-CeO2-CoOx composite nanocatalyst.

Electrochemical Removal of Metal-Organic Complexes in Metal Plating Wastewater: A Comparative Study of Cu-EDTA and Ni-EDTA Removal Mechanisms.

Effect of cerium on the anodic corrosion of Pb–Ca–Sn alloy in sulfuric acid solution

Universal Strike-Plating Strategy to Suppress Hydrogen Evolution for Improving Zinc Metal Reversibility