Abstract:Boiling is widely employed in practical applications due to its excellent heat-transfer characteristics. To meet the ever-increasing demand of heat dissipation, boiling optimization is an important topic in heat transfer research. In this work, saturated pool boiling experiments were conducted on thin copper wires with superhydrophobic micropatterns. The investigation was conducted on a thin copper wire patterned with superhydrophobic sites. The wire was 150 mu m in diameter and 85 mm in length. Briefly, the wire was first uniformly coated with a photoresist. The patterns were then created by a means of soft lithography using with a photo-plotted mask. Afterwards, an electroless galvanic deposition method was applied to coat a thin superhydrophobic layer onto the exposed copper patterns, by consecutively immersing the wire in AgNO3 and heptadecafluoro-1-decanethiol (HDFT) solutions. Finally, the remaining photoresist on the wire was removed, leaving the superhydrophobic micropatterns coated onto the copper surface. In most tests, the patterns were 100 mu m wide with 3-mm separation distance. De-ionized (DI) water was used as the working fluid, and boiled and degassed for 30 minutes in the chamber prior to the measurement. The testing wire was also heated in the chamber to degas. A high-speed CCD camera up to 30000 frames per second was mounted on a microscope for continuous imaging of bubble formation. Optical illumination was achieved by a fiber optic illuminator system. The superhydrophobic pattern lowered the superheat for bubble nucleation. Larger pattern area led to lower superheat. The superheat dropped from 7.3 to 4.2 degrees C when the pattern width increased from 20 to 1000 mu m. When bubble grew on the pattern site, there was a neck region connecting the detaching bubble and the pattern. As the bubble detached with the breakage in the middle of the neck region, a residual bubble still remained, which served as the embryo for the next cycle. However, the existence of the embryo didn't significantly facilitate the bubbling process itself, as compared to that over the bare copper region. The bubble interactions on the superhydrophobic micropatterns were studied. Different boiling regimes were observed as the heat flux increased: (1) Isolated on-pattern bubbling regime; (2) on-pattern coalescence regime; (3) cross-pattern coalescence. The superhydrophobic micropatterns played dominant roles in bubble formation as well as the bubble interactions. The bubbles on the bare copper surface could not grow independently. Heat transfer efficiency was enhanced by 40%-60% as compared to that on the bare copper wire. The wettability patterning on the wire significantly lowered the nucleation temperature, while increasing the bubble density. However, no appreciable change over the bubble detachment volume and frequency on single nucleation site was observed. Based on the observed bubble parameters, the nucleate boiling heat transfer can be predicted and calculated by using the heat flux partitioning model. The heat transfer comprised of three components: Natural convection, latent heat of bubble growth, and transient conduction caused by bubble growth and detachment. The third mechanism was found to be the major contributor to the heat transfer in the studied nucleate boiling on the patterned wires. Future work is needed to clarify the optimal distribution of the patterns, which is supposed to be related to the wire geometry, conductivity and capacity.

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