Abstract:The paper reports the creation of a nano-soldering method in a circuit with tungsten microneedles separated by an air gap. An external voltage was applied to the microneedles separated by air gap. During the experiments, a plasma discharge, and the formation of metallic-organic composite "nano-fluff" on tungsten microneedles was observed. At the same time, the current-voltage characteristic (CVC) was studied. The CVC revealed the regions of negative differential resistance that arose at the moment of formation of the plasma discharge. In the three-needle design, the reliable electrical and mechanical contact was achieved between two microneedle due to nano-fluff formation, featuring a new approach to the creation of the nano-soldering technology for 3D mechanical bottom-up nano-assembling of individual nano-devices.

Creation of the Nano-Soldering Technology for 3D Mechanical Bottomup Nano-Assembling of Individual Nanodevices