Optimized Design of Contact Interfaces for Enhanced Heat Dissipation in Flip-Chip Package

Chen Wang,Mingjun Qiu,Zongkun Pan,Kaiyi Zhou,Tao Wang,Jun Hong,Qiyin Lin

DOI: https://doi.org/10.1016/j.applthermaleng.2024.124936

IF: 6.4

2024-01-01

Applied Thermal Engineering

Abstract:Flip-chip packaging technology is widely employed in various electronic products, and its thermal performance plays is crucial in determining the overall efficacy of these devices. The traditional thermal design approach for filling thermal interface materials does not effectively improve the thermal performance. This study, focusing on the physical nature of inadequate contact thermal performance, moves away from the traditional uniform distribution of contact interface material properties. Instead, it proposes a novel thermal design method employing a differential distribution of contact interface material properties for flip-chip packages. A fast progressive iterative algorithm for the elastic modulus at contact interfaces is proposed. Furthermore, the thermal performance of the original uniform distribution design, the traditional thermal design filled with thermal interface materials with different properties, and the innovative thermal design were compared. The results indicate that the TCRs decreased from 2.89 × 10-5 K⋅W−1⋅m−2 before optimization to 7.38 × 10-6 K⋅W−1⋅m−2 after optimization, representing a reduction of 74.46 %. The traditional thermal design with optimal properties and the innovative thermal design reduce the maximum temperature by 1.54 K and 2.2 K compared the uniform distribution design. This method enhances thermal performance by 42.86 % over traditional thermal design, providing a novel approach to the thermal design of electronic equipment.