Construction of Flame Retardant Functionalized Carbon Dot with Insulation, Flame Retardancy and Thermal Conductivity in Epoxy Resin

Peixiao Sun,Hongjian Zhang,Yang Leng,Zhao Wang,Jun Zhang,Miaojun Xu,Xiaoli Li,Bin Li

DOI: https://doi.org/10.1016/j.conbuildmat.2024.138853

IF: 7.4

2024-01-01

Construction and Building Materials

Abstract:The concurrent fabrication of packaging materials with minimal additive concentrations, flame retardancy and superior thermal conductivity has consistently posed a significant challenge for materials scientists. Herein, a zero-dimensional carbon dot (CD) doped with nitrogen (N) and boron (B) elements was synthesized to serve as a thermal conductive filler. Subsequently, diethyl aluminum hypophosphate (ADP) and this doped CD were assembled via electrostatic interactions, resulting in the formation of ADP@CD. And a multifunctional epoxy resin thermoset material (EP/ADP@CD) with smoke suppression, toxicity reduction and excellent thermal conductivity was prepared using ADP@CD as fillers. Notably, when the combined addition of ADP@CD was restricted to merely1.5 wt%, with a ratio of ADP to CD being 1: 0.5 wt%, the EP/ADP@CD thermosets achieved a V-0 rating in the vertical flame (UL-94) test, despite a lower overall flame retardant concentration. Furthermore, it exhibited a limiting oxygen index (LOI) of 36.1 %. Meanwhile, compared to pure EP, EP/1.5ADP@CD thermosets exhibited a reduction in total heat release (THR), total smoke release (TSP) and carbon dioxide emissions (CO2P), which was as high as 25.8 %, 25.6 % and 40.1 %, respectively. The mechanical characteristics of the EP thermosets were little impacted by the extremely small additions of ADP@CD. Meanwhile, the EP/1.8ADP@CD (ADP:CD = 1:0.8 wt%) thermosets achieved a thermal conductivity of 1.1 Wm- 1 K-1, which was 302 % higher than that of pure EP. In conclusion, this study provides a new option for constructing a new thinking for the exploitation of low addition amounts and multifunctional epoxy resins.