Abstract:Given the lightweight nature and excellent thermal conductivity of aluminum, it offers significant potential for light-weighting of phase-change cooling components. To further enhance the thermal performance of aluminumbased vapor chambers, this study utilized selective laser melting (SLM) to design and integrally manufacture the slightly oleophilic wick for the condenser of the aluminum-based vapor chamber, along with three different superoleophilic wick structures for the evaporator: the gyroid bionic composite porous wick vapor chamber (GBCPVC), the groove composite porous wick vapor chamber (GCPVC), and the uniform porous wick vapor chamber (UPVC). A water-cooling experimental setup was established, and the effects of wick structure, cooling water flow rate, and cooling water temperature on the maximum heat load, temperature uniformity, and thermal resistance of vapor chambers were systematically investigated. The results indicated that the gyroid bionic porous wick structure significantly enhanced the thermal performance of the vapor chamber. Under the same conditions, GBCPVC exhibited lower thermal resistance and superior temperature uniformity, achieving a higher heat load than GCPVC and UPVC. When the cooling water temperature was decreased, its maximum heat load significantly increased. Specifically, at 15 degrees C, the maximum heat load for GBCPVC reached 300 W, an increase of 33.33 % and 53.33 % compared to 25 degrees C and 35 degrees C, respectively. Conversely, a rise in cooling water temperature enhanced the temperature uniformity and reduced thermal resistance of CBCPVC. At 35 degrees C and a heat load of 120 W, GBCPVC achieved a minimum thermal resistance of 0.034 K/W and a maximum temperature difference of 1.46 degrees C. Additionally, an increased flow rate enhanced the maximum heat load of GBCPVC, and under high heat loads, it could also reduce the thermal resistance and improve temperature uniformity. This study provides new insights and solutions for the thermal management of phase-change cooling components in aerospace electronic devices.

Design and Fabrication of Ultrathin Aluminum Vapor Chambers with Layered Heterogeneous Vapor-Liquid Channel Structures

Design and Fabrication of a Large Area Ultrathin Vapor Chamber Based on Print-Wick-Structuring Technology

Enhancing Heat Transfer Performance of Aluminum-Based Vapor Chamber with a Novel Bionic Wick Structure Fabricated Using Additive Manufacturing

Fabrication and Thermal Performance of Mesh-Type Ultra-Thin Vapor Chambers

Fabrication and characterization of ultra-thin vapour chambers with printed copper powder wick

Experimental Investigation on Ultra-Thin Vapor Chamber with Composite Wick for Electronics Thermal Management

Experimental Investigation on the Thermal Performance of a Large-Size Aluminum Vapor Chamber for Multi-Point Heat Sources

Thermal performance of ultra-thin vapor chamber with etched micro-structure for electronics cooling

Vapor-liquid Coplanar Structure Enables High Thermal Conductive and Extremely Ultrathin Vapor Chamber

Enhanced Heat Transfer Performance in Vapor Chambers Via Fabrication of Novel Regular Composite Porous Wick Structures Using Selective Laser Melting

A novel ultra-thin vapor chamber with composite wick for portable electronics cooling

Heat transfer performance analysis of an ultra-thin aluminum vapor chamber with serrated microgrooves

Influence of vapor core design on thermal and hydraulic performance of mesh-type ultra-thin vapor chamber

Experimental study of large-area ultra-thin vapor chamber for microelectronic heat dissipation

Performance and Design Optimization of Utvc with Thickness of 0.22 Mm

Enhancing heat transfer performance in 3D-printed integrated vapor chamber using composite structures

An Ultra-Thin Vapor Chamber with Oriented Spiral Woven Wick for Microelectronic Heat Dissipation

Heat Transfer Capacity Optimization Design of Microgroove and Microcolumn in an Ultra-Thin Flat Heat Pipe

An improved vapor chamber with enhanced two-phase transport by using structured surfaces

Microstructured Wettability Pattern for Enhancing Thermal Performance in an Ultrathin Vapor Chamber

Design, Fabrication and Thermal Performance of a Novel Ultra-Thin Vapour Chamber for Cooling Electronic Devices