A 210-to-250 GHz Sliding-IF Frequency-interleaved Transceiver with On-chip Bow-tie Antenna and 4Th-Order FIR-embedded Digital Modulator

Linjun Gu,Wei Deng,Junlong Gong,Taikun Ma,Haikun Jia,Qixiu Wu,Jiamin Xue,Dongfang Li,Hongzhuo Liu,Yaqian Sun,Baoyong Chi
DOI: https://doi.org/10.1109/rfic61187.2024.10599928
2024-01-01
Abstract:This paper introduces a THz sliding-IF frequency-interleaved transceiver with an on-chip bow-tie antenna and a 4th-order FIR-embedded digital modulator. As for the transmitter (TX), two independent baseband signals are dual-up converted to the THz band and then interleaved. As for the receiver (RX), the interleaved signals are dual-down converted and separated back to each independent baseband signal. The quadrature LO signal generator with one input port is realized for both IF and RF conversion. The 4th-order FIR-embedded direct-modulation digital modulator using a 1-bit D/A interface is introduced for performing the quadrature up-conversion and modulation. The ultra-wide-band on-chip bow-tie antenna provides a solution for interconnections between chips and antennas. The three-line balun based LNA and PA are proposed for achieving wideband performance in the THz band. While limited by the measurement equipment, this work still demonstrates 16 Gb/s data transmission through two independent 2Gbaud data streams in 16-QAM modulation.
What problem does this paper attempt to address?